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1. WO2020133672 - ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR AND DISPLAY PANEL

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Publication Number WO/2020/133672
Publication Date 02.07.2020
International Application No. PCT/CN2019/076232
International Filing Date 27.02.2019
IPC
H01L 27/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
H01L 21/77 2017.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
CPC
H01L 21/77
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
H01L 27/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
Applicants
  • 深圳市华星光电半导体显示技术有限公司 SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 陈书志 CHEN, Shujhih
  • 陈俊吉 CHEN, Chunchi
Agents
  • 深圳翼盛智成知识产权事务所（普通合伙） ESSEN PATENT&TRADEMARK AGENCY
Priority Data
201811602885.726.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR AND DISPLAY PANEL
(FR) SUBSTRAT DE RÉSEAU ET SON PROCÉDÉ DE FABRICATION ET PANNEAU D'AFFICHAGE
(ZH) 阵列基板及其制作方法、显示面板
front page image
Abstract
(EN)
The present application provides an array substrate and a manufacturing method therefor, and a display panel. The array substrate comprises: a substrate. An active layer is disposed on the substrate. A gate insulating layer is disposed on the active layer. A metal layer is disposed on the gate insulating layer. The active layer comprises a source and a drain at two ends thereof, and a channel region disposed between the source and the drain.
(FR)
La présente invention concerne un substrat de réseau et son procédé de fabrication, et un panneau d'affichage. Le substrat de réseau comprend: un substrat. Une couche active est disposée sur le substrat. Une couche d'isolation de grille est disposée sur la couche active. Une couche métallique est disposée sur la couche d'isolation de grille. La couche active comprend une source et un drain au niveau de deux extrémités de celle-ci, et une région de canal disposée entre la source et le drain.
(ZH)
本申请提出了一种阵列基板及其制作方法、显示面板。该阵列基板包括基板。设置在基板上的有源层。设置在有源层上的栅绝缘层。设置在栅绝缘层上的金属层。其中，该有源层包括两端的源极和漏极，以及位于该源极和漏极之间的沟道区。
Also published as
CN109755261
Latest bibliographic data on file with the International Bureau
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