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1. WO2020133494 - RESIN COMPOSITION, PREPREG, LAMINATED BOARD, METAL FOIL-CLAD LAMINATED BOARD, AND PRINTED CIRCUIT BOARD

Publication Number WO/2020/133494
Publication Date 02.07.2020
International Application No. PCT/CN2018/125814
International Filing Date 29.12.2018
IPC
C08L 63/00 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08G 59/62 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
62Alcohols or phenols
C08L 83/04 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
CPC
C08G 59/62
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
40characterised by the curing agents used
62Alcohols or phenols
C08L 63/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08L 83/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
Applicants
  • 广东生益科技股份有限公司 SHENGYI TECHNOLOGY CO. , LTD. [CN]/[CN]
Inventors
  • 唐军旗 TANG, Junqi
  • 李志光 LI, Zhiguang
Agents
  • 中科专利商标代理有限责任公司 CHINA SCIENCE PATENT & TRADEMARK AGENT LTD.
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) RESIN COMPOSITION, PREPREG, LAMINATED BOARD, METAL FOIL-CLAD LAMINATED BOARD, AND PRINTED CIRCUIT BOARD
(FR) COMPOSITION DE RÉSINE, PRÉIMPRÉGNÉ, CARTE STRATIFIÉE, CARTE STRATIFIÉE PLAQUÉE DE FEUILLE MÉTALLIQUE, CARTE DE CIRCUIT IMPRIMÉ
(ZH) 树脂组合物、预浸料、层压板、覆金属箔层压板和印刷线路板
Abstract
(EN)
A resin composition, and a prepreg, a laminated board, a metal foil-clad laminated board and a printed circuit board made by the resin composition. The resin composition comprises an epoxy resin (A), a phenolic curing agent (B), and organic silicone rubber (C). The resin composition, and the prepreg, the laminated board and the metal foil-clad laminated board made by the resin composition have characteristics such as good heat resistance, low modulus, and low coefficient of thermal expansion, and can inhibit the phenomenon of cracks on a pad during a processing process for a printed circuit board.
(FR)
La présente invention concerne une composition de résine, ainsi qu'un préimprégné, une carte stratifiée, une carte stratifiée recouverte d'une feuille métallique et une carte de circuit imprimé élaborés au moyen de la composition de résine. La présente invention concerne une composition de résine qui contient une résine époxy (A), un agent de durcissement phénolique (B) et un caoutchouc au silicone organique (C). La composition de résine et le préimprégné, la carte stratifiée et la carte stratifiée plaquée de feuille métallique fabriqués au moyen de la composition de résine ont des caractéristiques telles qu'une bonne résistance à la chaleur, un faible module et un faible coefficient de dilatation thermique, et peut empêcher le phénomène de fissures sur un tampon pendant un processus de traitement pour une carte de circuit imprimé.
(ZH)
一种树脂组合物及使用其制作的预浸料、层压板、覆金属箔层压板以及印刷线路板,该树脂组合物包括环氧树脂(A)、酚性固化剂(B)、有机硅橡胶(C)。该树脂组合物及使用其制得的预浸料、层压板以及覆金属箔层压板具有良好的耐热性及低模量、低热膨胀系数的特性,可以抑制印刷线路板加工过程中焊盘开裂的现象。
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Latest bibliographic data on file with the International Bureau