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1. WO2020133443 - FLEXIBLE TOUCH SENSOR AND MANUFACTURING METHOD THEREFOR, AND TOUCH DEVICE

Publication Number WO/2020/133443
Publication Date 02.07.2020
International Application No. PCT/CN2018/125717
International Filing Date 29.12.2018
IPC
G06F 3/041 2006.1
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01Input arrangements or combined input and output arrangements for interaction between user and computer
03Arrangements for converting the position or the displacement of a member into a coded form
041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
H01L 27/32 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
CPC
G06F 3/041
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01Input arrangements or combined input and output arrangements for interaction between user and computer
03Arrangements for converting the position or the displacement of a member into a coded form
041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
Applicants
  • 深圳市柔宇科技有限公司 SHENZHEN ROYOLE TECHNOLOGIES CO. , LTD. [CN]/[CN]
Inventors
  • 包春贵 BAO, Chungui
  • 陈靖 CHEN, Jing
  • 李贺 LI, He
  • 曾露 ZENG, Lu
  • 雷晓华 LEI, Xiaohua
Agents
  • 深圳市六加知识产权代理有限公司 LIUJIA CHINA IP LAW OFFICE
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) FLEXIBLE TOUCH SENSOR AND MANUFACTURING METHOD THEREFOR, AND TOUCH DEVICE
(FR) CAPTEUR TACTILE FLEXIBLE ET SON PROCÉDÉ DE FABRICATION, ET DISPOSITIF TACTILE
(ZH) 一种柔性触控传感器及其制作方法、触控装置
Abstract
(EN)
A flexible touch sensor and a manufacturing method therefor, and a touch device, the manufacturing method comprising: providing a protective layer thin film (32) on a conductive thin film (31); covering a lid (33) on the protective layer thin film (32); providing at least one opening (321) on the protective layer thin film (32); and bending the conducive thin film (31) and the protective layer thin film (32) at the opening (321) in the direction facing away from the lid (33), and sealing the bent opening (321). In the described manufacturing method, the opening (321) is provided on the protective layer thin film (32) before bending the conducive thin film (31) and the protective layer thin film (32) in the direction facing away from the lid (33) so that the stress within the protective layer thin film (32) is dispersed when the conducive thin film (31) is bent, which may prevent delamination between the conducive thin film (31) and the lid (33).
(FR)
L'invention concerne un capteur tactile flexible et son procédé de fabrication, et un dispositif tactile, le procédé de fabrication consistant à : fournir un film mince de couche protectrice (32) sur un film mince conducteur (31) ; recouvrir un couvercle (33) sur le film mince de couche protectrice (32) ; fournir au moins une ouverture (321) sur le film mince de couche protectrice (32) ; et courber le film mince conducteur (31) et le film mince de couche protectrice (32) au niveau de l'ouverture (321) dans la direction opposée au couvercle (33), et sceller l'ouverture courbée (321). Dans le procédé de fabrication décrit, l'ouverture (321) est disposée sur le film mince de couche protectrice (32) avant de courber le film mince conducteur (31) et le film mince de couche protectrice (32) dans la direction opposée au couvercle (33) de telle sorte que la contrainte au sein du film mince de couche protectrice (32) est dispersée lorsque le film mince conducteur (31) est courbé, ce qui peut empêcher une déstratification entre le film mince conducteur (31) et le couvercle (33).
(ZH)
一种柔性触控传感器及其制作方法、触控装置,该制作方法包括:在导电薄膜(31)上设置保护层薄膜(32);将盖板(33)盖设于保护层薄膜(32)上;在保护层薄膜(32)上开设至少一个开口(321);在开口(321)处,将导电薄膜(31)和保护层薄膜(32)沿背向盖板(33)的方向弯曲,并密封弯曲后的开口(321)。该制作方法在将导电薄膜(31)和保护层薄膜(32)沿背向盖板(33)的方向弯曲时,事先在保护层薄膜(32)上开设开口(321),这样导电薄膜(31)在弯曲时,其保护层薄膜(32)内应力分散,可避免导电薄膜(31)与盖板(33)间的分层。
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