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1. WO2020133421 - DIVERSIFIED ASSEMBLY PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD

Publication Number WO/2020/133421
Publication Date 02.07.2020
International Application No. PCT/CN2018/125657
International Filing Date 29.12.2018
IPC
H05K 1/00 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
H05K 3/40 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
H05K 3/46 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
CPC
H05K 1/141
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
H05K 1/145
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
145Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
H05K 2201/032
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
032Materials
H05K 2201/041
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
04Assemblies of printed circuits
041Stacked PCBs, i.e. having neither an empty space nor mounted components in between
H05K 2201/045
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
04Assemblies of printed circuits
045Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
H05K 2201/10515
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10431Details of mounted components
10507Involving several components
10515Stacked components
Applicants
  • 深南电路股份有限公司 SHENNAN CIRCUITS CO., LTD. [CN]/[CN]
Inventors
  • 冷科 LENG, Ke
  • 刘海龙 LIU, Hailong
  • 刘金峰 LIU, Jinfeng
  • 武凤伍 WU, Fengwu
  • 陈利 CHEN, Li
  • 张利华 ZHANG, Lihua
Agents
  • 深圳市威世博知识产权代理事务所(普通合伙) CHINA WISPRO INTELLECTUAL PROPERTY LLP.
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) DIVERSIFIED ASSEMBLY PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD
(FR) CARTE DE CIRCUIT IMPRIMÉ D'ASSEMBLAGE DIVERSIFIÉ ET PROCÉDÉ DE FABRICATION
(ZH) 多样化装配印刷线路板及制造方法
Abstract
(EN)
A diversified assembly printed circuit board and a manufacturing method. The circuit board comprises: a first printed circuit board (1), provided with a plurality of protruding first conductive metals (11); and a plurality of second printed circuit boards (2), each second printed circuit board (2) is provided with a plurality of protruding second conductive metals (21), the second printed circuit boards (2) being separately connected to the first printed circuit board (1), wherein at a connection position between each second printed circuit board (2) and the first printed circuit board (1), a solidified conductive metal slurry (3) is provided between the corresponding second conductive metal (21) and the first conductive metal (11) for implementing electric connection between the second conductive metal (21) and the first conductive metal (11), and a laminated bonding piece (4) is provided between the area outside the second conductive metal and the area outside the first conductive metal for implementing non-electric connection between the second printed circuit board (2) and the first printed circuit board (1). By using the mode above, a technical support is provided for forming a complex and ultra-highly integrated space interconnecting structure by stacking in a Z direction.
(FR)
L'invention concerne une carte de circuit imprimé d'assemblage diversifié et un procédé de fabrication. La carte de circuit imprimé comprend : une première carte de circuit imprimé (1), pourvue d'une pluralité de premiers métaux conducteurs saillants (11) ; et une pluralité de secondes cartes de circuit imprimé (2), chaque seconde carte de circuit imprimé (2) est pourvue d'une pluralité de seconds métaux conducteurs saillants (21), les secondes cartes de circuit imprimé (2) étant connectées séparément à la première carte de circuit imprimé (1), dans une position de connexion entre chaque seconde carte de circuit imprimé (2) et la première carte de circuit imprimé (1), une pâte métallique conductrice solidifiée (3) étant disposée entre le second métal conducteur correspondant (21) et le premier métal conducteur (11) pour mettre en oeuvre une connexion électrique entre le second métal conducteur (21) et le premier métal conducteur (11), et un élément de liaison stratifié (4) étant disposée entre la zone à l'extérieur du second métal conducteur et la zone à l'extérieur du premier métal conducteur pour mettre en oeuvre une connexion non électrique entre la seconde carte de circuit imprimé (2) et la première carte de circuit imprimé (1). En utilisant le mode ci-dessus, un support technique est prévu pour former une structure d'interconnexion spatiale complexe et ultra-hautement intégrée par empilement dans une direction Z.
(ZH)
一种多样化装配印刷线路板及制造方法,该线路板包括:第一印刷线路板(1),其上设置有多个突出的第一导电金属(11);多个第二印刷线路板(2),每个第二印刷线路板(2)上设置有多个突出的第二导电金属(21),多个第二印刷线路板(2)分别与第一印刷线路板(1)连接;其中,每个第二印刷线路板(2)与第一印刷线路板(1)的连接位置,在相互对应的第二导电金属(21)与第一导电金属(11)之间设置有凝固后的导电金属浆(3)而实现第二导电金属(21)与第一导电金属(11)之间的电连接,在非第二导电金属与非第一导电金属之间设置有层压粘结片(4)而实现第二印刷线路板(2)与第一印刷线路板(1)之间的非电连接。通过上述方式,能够为在Z方向堆叠形成复杂的超高集成的空间互联结构提供技术支持。
Also published as
JP2021512981
Latest bibliographic data on file with the International Bureau