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1. WO2020133335 - THERMOSETTING RESIN COMPOSITION, PREPREG USING SAME, METAL FOIL-CLADDED LAMINATE, AND PRINTED CIRCUIT BOARD

Publication Number WO/2020/133335
Publication Date 02.07.2020
International Application No. PCT/CN2018/125306
International Filing Date 29.12.2018
IPC
C08G 59/62 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
62Alcohols or phenols
C08G 59/42 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
42Polycarboxylic acids; Anhydrides, halides, or low-molecular-weight esters thereof
C08J 5/24 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 15/092 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08of synthetic resin
092comprising epoxy resins
B32B 27/06 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
06as the main or only constituent of a layer next to another layer of a specific substance
B32B 27/08 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
06as the main or only constituent of a layer next to another layer of a specific substance
08of synthetic resin of a different kind
CPC
B32B 15/092
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
04comprising metal as the main or only constituent of a layer, ; which is; next to another layer of ; the same or of; a ; different material
08of synthetic resin
092comprising epoxy resins
B32B 2457/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2457Electrical equipment
08PCBs, i.e. printed circuit boards
B32B 27/06
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
06as the main or only constituent of a layer, ; which is; next to another layer of ; the same or of; a ; different material
B32B 27/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
06as the main or only constituent of a layer, ; which is; next to another layer of ; the same or of; a ; different material
08of synthetic resin
B32B 27/18
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
18characterised by the use of special additives
B32B 27/38
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
38comprising epoxy resins
Applicants
  • 广东生益科技股份有限公司 SHENGYI TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 游江 YOU, Jiang
  • 林伟 LIN, Wei
  • 黄天辉 HUANG, Tianhui
Agents
  • 北京品源专利代理有限公司 BEYOND ATTORNEYS AT LAW
Priority Data
201811606732.X26.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) THERMOSETTING RESIN COMPOSITION, PREPREG USING SAME, METAL FOIL-CLADDED LAMINATE, AND PRINTED CIRCUIT BOARD
(FR) COMPOSITION DE RÉSINE THERMODURCISSABLE, PRÉIMPRÉGNÉ L'UTILISANT, STRATIFIÉ REVÊTU D'UNE FEUILLE MÉTALLIQUE ET CARTE DE CIRCUIT IMPRIMÉ
(ZH) 一种热固性树脂组合物及使用其的预浸料、覆金属箔层压板和印制电路板
Abstract
(EN)
Provided in the present invention are a thermosetting resin composition, a prepreg using same, a metal foil-cladded laminate, and a printed circuit board. The thermosetting resin composition comprises an epoxy resin, a phosphorous-containing bisphenol, and an ester curing agent having the structure of formula I. The present invention employs the ester curing agent having the structure of formula I and the phosphorous-containing bisphenol for co-curing of the epoxy resin, uses the phosphorous-containing bisphenol as a primary curing agent, provides a cured substance with great dielectric performance, high temperature resistance, and adhesion, also implements halogen-free flame retardation, combined with the ester curing agent of the structure of formula I, produces no polar groups such as a secondary hydroxyl, and significantly increases the glass transition temperature of the cured substance while ensuring great dielectric performance, and, with the cured substance containing a large amount of hydrophobic groups, significantly reduces the water absorption rate of the cured substance, thus increasing the stability of the dielectric constant and of the dielectric loss factor of the cured substance. The laminate manufactured and the metal foil-cladded laminate have great heat resistance, moisture resistance, peel strength, dielectric performance, and flame retardancy.
(FR)
La présente invention concerne une composition de résine thermodurcissable, un préimprégné l'utilisant, un stratifié revêtu d'une feuille métallique et une carte de circuit imprimé. La composition de résine thermodurcissable comprend une résine époxy, un bisphénol contenant du phosphore et un agent de durcissement de type ester ayant la structure de formule I. La présente invention utilise l'agent de durcissement de type ester ester ayant la structure de formule I et le bisphénol contenant du phosphore pour codurcir la résine époxy, utilise le bisphénol contenant du phosphore comme agent de durcissement primaire, fournit une substance durcie présentant de bonnes performances diélectriques, une résistance à la température et une adhérence élevées, et met également en œuvre un effet retardateur de flamme sans halogène, en association avec l'agent de durcissement de type ester ayant la structure de formule I, ne produit aucun groupe polaire comme un hydroxyle secondaire, et augmente significativement la température de transition vitreuse de la substance durcie tout en assurant de bonnes performances diélectriques, et, avec la substance durcie contenant une grande quantité de groupes hydrophobes, réduit significativement le taux d'absorption d'eau de la substance durcie, augmentant ainsi la stabilité de la constante diélectrique et du facteur de perte diélectrique de la substance durcie. Le stratifié fabriqué et le stratifié revêtu d'une feuille métallique présentent une bonne résistance à la chaleur, une bonne résistance à l'humidité, une bonne résistance au pelage, de bonnes performances diélectriques et une grande ininflammabilité.
(ZH)
本发明提供了一种热固性树脂组合物及使用其的预浸料、覆金属箔层压板和印制电路板。热固性树脂组合物包括环氧树脂、含磷双酚和具有式I结构的酯类固化剂。本发明采用具有式I结构的酯类固化剂与含磷双酚协同固化环氧树脂,用含磷双酚为主固化剂,赋予了固化物优异的介电性能、高耐热性和粘合力,同时还能实现无卤阻燃,结合式I结构的酯类固化剂,使得在固化过程中不产生二次羟基等极性基团,可在保证介电性能优异的同时明显提高固化物玻璃化转变温度,且固化产物中含有大量疏水基团,能大幅降低固化物吸水率,使得固化物介电常数和介电损耗因子更加稳定。制备的层压板和覆金属箔层压板具有良好的耐热性、耐湿性、剥离强度、介电性能和阻燃性。
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