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1. WO2020133229 - FLEXIBLE MODULE FOR FLEXIBLE ELECTRONIC DEVICE

Publication Number WO/2020/133229
Publication Date 02.07.2020
International Application No. PCT/CN2018/124923
International Filing Date 28.12.2018
IPC
H01L 27/12 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
CPC
H01L 27/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
Applicants
  • 深圳市柔宇科技有限公司 SHENZHEN ROYOLE TECHNOLOGIES CO., LTD. [CN]/[CN]
Inventors
  • 李贺 LI, He
Agents
  • 北京超凡志成知识产权代理事务所 (普通合伙) CHOFN INTELLECTUAL PROPERTY
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) FLEXIBLE MODULE FOR FLEXIBLE ELECTRONIC DEVICE
(FR) MODULE FLEXIBLE DESTINÉ À UN DISPOSITIF ÉLECTRONIQUE FLEXIBLE
(ZH) 用于柔性电子设备的柔性模组
Abstract
(EN)
A flexible module (100) for a flexible electronic device, comprising a substrate (10), a functional assembly (20), and a connection assembly (30). The substrate (10) comprises first areas (11) capable of being recoverably stretched or bent under the action of external forces, and second areas (13) connected to the first areas (11). The stretch rate of the second areas (13) is lower than that of the first areas (11); the functional assembly (20) comprises electronic components (21) mounted in the second areas (13); the connection assembly (30) comprises wires (31) for establishing electrical connection between the electronic components (21); each wire (31) comprise a stretchable section (32) provided in each first area (11) and capable of being stretched or bent together with each first area (11).
(FR)
La présente invention porte sur un module flexible (100) destiné à un dispositif électronique flexible, comprenant un substrat (10), un ensemble fonctionnel (20), et un ensemble de connexion (30). Le substrat (10) comprend des premières zones (11) pouvant être étirées ou pliées puis retrouver leur forme initiale sous l'action de forces externes, et des secondes zones (13) reliées aux premières zones (11). Le taux d'étirement des secondes zones (13) est inférieur à celui des premières zones (11) ; l'ensemble fonctionnel (20) comprend des composants électroniques (21) montés dans les secondes zones (13) ; l'ensemble de connexion (30) comprend des fils (31) servant à établir une connexion électrique entre les composants électroniques (21) ; chaque fil (31) comprend une section étirable (32) située dans chaque première zone (11) et pouvant être étirée ou pliée conjointement avec chaque première zone (11).
(ZH)
一种用于柔性电子设备的柔性模组(100),包括基板(10)、功能组件(20)及连接组件(30);所述基板(10)包括能够在外力作用下产生可恢复的拉伸或弯折的第一区域(11),以及与所述第一区域(11)连接的第二区域(13),所述第二区域(13)的拉伸率低于所述第一区域(11)的拉伸率;所述功能组件(20)包括装设在所述第二区域(13)上的电子元器件(21);所述连接组件(30)包括用于为所述电子元器件(21)建立电性连接的导线(31),所述导线(31)包括在第一区域(11)设置的能够随所述第一区域(11)一起产生拉伸或弯折的可拉伸段(32)。
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