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1. WO2020129410 - ULTRASONIC SOLDERING DEVICE AND ULTRASONIC SOLDERING METHOD

Publication Number WO/2020/129410
Publication Date 25.06.2020
International Application No. PCT/JP2019/042073
International Filing Date 25.10.2019
IPC
B23K 3/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
B23K 3/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
02Soldering irons; Bits
H01L 31/05 2014.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
04adapted as photovoltaic conversion devices
042PV modules or arrays of single PV cells
05Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
Applicants
  • アートビーム有限会社 ARTBEAM CO.,LTD. [JP]/[JP]
Inventors
  • 新井 傑也 ARAI Katsuya
  • 菅原 ミエ子 SUGAWARA Mieko
  • 小林 賢一 KOBAYASHI Kenichi
  • 小宮 秀利 KOMIYA Hidetoshi
  • 松井 正五 MATSUI Shogo
  • 錦織 潤 NISHIGORI Jun
Agents
  • 岡田 守弘 OKADA Morihiro
Priority Data
2018-23637718.12.2018JP
2019-03781401.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ULTRASONIC SOLDERING DEVICE AND ULTRASONIC SOLDERING METHOD
(FR) PROCÉDÉ DE BRASAGE PAR ULTRASONS ET DISPOSITIF DE BRASAGE PAR ULTRASONS
(JA) 超音波半田付け装置および超音波半田付け方法
Abstract
(EN)
[Purpose] The present invention relates to an ultrasonic soldering device and an ultrasonic soldering method, and the purpose of the present invention is to form a uniform, thin, and robust solder layer without thermal damage and ultrasonic damage to a film of a substrate. [Configuration] Provided is an ultrasonic soldering device characterized by comprising a bit heating device, an ultrasonic oscillation device, a solder preliminary heating device, a solder slide device, and a bit moving device, and characterized in that preliminarily heated, string-shaped solder is melted with a bit part, ultrasonic is applied thereto, an adhesion of a close substrate part is removed, and melted solder is adhered to the substrate part to perform soldering.
(FR)
L’objectif de la présente invention se rapporte à un dispositif de brasage par ultrasons et un procédé de brasage par ultrasons, et l’objectif de la présente invention est de former une fine couche de brasure uniforme et robuste sans détérioration thermique et ultrasonore d’un film d'un substrat. L’invention est conçue de sorte qu’un dispositif de brasage par ultrasons soit caractérisé en ce qu'il comprend un dispositif de chauffage de panne, un dispositif d'oscillation ultrasonore, un dispositif de chauffage préliminaire de brasure, un dispositif coulissant pour brasure et un dispositif de déplacement de panne, et qu’il soit caractérisé en ce qu’une brasure en forme de cordon préalablement chauffée est fondue à l’aide d’une partie panne, des ultrasons lui sont appliqués, l’adhérence d'une partie substrat proche est retirée, et une brasure fondue est amenée à adhérer à la partie substrat pour effectuer un brasage.
(JA)
【目的】本発明は、超音波半田付け装置および超音波半田付け方法に関し、基板の膜への熱損傷、超音波損傷なしに均一かつ薄くかつ強固な半田層の形成を目的とする。 【構成】コテ先加熱装置と、超音波発振装置と、半田予備加熱装置と、半田スライド装置と、コテ先移動装置とを備え 予備加熱した糸状の半田をコテ先部分で溶解かつ超音波を印加し、近接した基板部分の付着物を除去して基板部分に溶融半田を付着させて半田付けすることを特徴とする超音波半田付け装置である。
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