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1. WO2020124423 - DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS

Publication Number WO/2020/124423
Publication Date 25.06.2020
International Application No. PCT/CN2018/122039
International Filing Date 19.12.2018
IPC
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
CPC
H01L 2227/323
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2227Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
32Devices including an organic light emitting device [OLED], e.g. OLED display
323Multistep processes for AMOLED
H01L 27/3227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3225OLED integrated with another component
3227the other component being a light sensitive element, e.g. inorganic solar cell, inorganic photodiode
H01L 27/3244
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
H01L 51/5209
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5203Electrodes
5206Anodes, i.e. with high work-function material
5209characterised by the shape
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
Inventors
  • 杨盛际 YANG, Shengji
  • 董学 DONG, Xue
  • 陈小川 CHEN, Xiaochuan
  • 王辉 WANG, Hui
  • 卢鹏程 LU, Pengcheng
  • 李胜男 LI, Shengnan
Agents
  • 中国国际贸易促进委员会专利商标事务所 CCPIT PATENT AND TRADEMARK LAW OFFICE
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS
(FR) PANNEAU D’AFFICHAGE ET SON PROCÉDÉ DE FABRICATION, ET APPAREIL D’AFFICHAGE
(ZH) 显示面板及其制造方法、显示装置
Abstract
(EN)
A display panel and a manufacturing method therefor, and a display apparatus. The display panel comprises: a substrate (11); a pixel unit array (12) disposed on one side of the substrate (11), wherein the pixel unit array (12) comprises a plurality of pixel units (20), at least one pixel unit (20) comprises an anode layer (21), a cathode layer (22) and a light-emitting layer (23) located between the anode layer (21) and the cathode layer (22), the cathode layer (22) is provided with an opening (221), and the opening (221) enables light emitted by the light-emitting layer (23) to penetrate through same; and at least one sensor (13) disposed on the side of the pixel unit array (12) away from the substrate (11), and used for detecting light penetrating through the opening (221).
(FR)
L’invention concerne un panneau d’affichage et son procédé de fabrication, et un appareil d’affichage. Le panneau d’affichage comprend : un substrat (11) ; une matrice d’unités de pixels (12) disposée sur un côté du substrat (11), la matrice d’unités de pixels (12) comprenant une pluralité d’unités de pixels (20), au moins une unité de pixel (20) comprenant une couche d’anode (21), une couche de cathode (22), et une couche électroluminescente (23) disposée entre la couche d’anode (21) et la couche de cathode (22), la couche de cathode (22) comportant une ouverture (221), et l’ouverture (221) permettant que la lumière émise par la couche électroluminescente (23) pénètre à travers cette dernière ; et au moins un capteur (13) disposé sur le côté de la matrice d’unités de pixels (12) éloigné du substrat (11), et servant à détecter la lumière pénétrant à travers l’ouverture (221).
(ZH)
一种显示面板及其制造方法、显示装置,显示面板包括:基板(11);像素单元阵列(12),设置在基板(11)的一侧,像素单元阵列(12)包括多个像素单元(20),至少一个像素单元(20)包括阳极层(21)、阴极层(22)以及位于阳极层(21)和阴极层(22)之间的发光层(23),阴极层(22)具有开口(221),开口(221)使得发光层(23)发出的光能够透过;至少一个传感器(13),设置在像素单元阵列(12)远离基板(11)的一侧,用于探测从开口(221)透过的光。
Also published as
CN201880002526.X
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