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1. WO2020124416 - FLEXIBLE PANEL AND METHOD FOR MANUFACTURING SAME

Publication Number WO/2020/124416
Publication Date 25.06.2020
International Application No. PCT/CN2018/121996
International Filing Date 19.12.2018
IPC
H01L 27/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
H01L 51/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 51/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
CPC
H01L 27/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
H01L 51/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • 深圳市柔宇科技有限公司 SHENZHEN ROYOLE TECHNOLOGIES CO., LTD. [CN]/[CN]
Inventors
  • 雷晓华 LEI, Xiaohua
  • 袁泽 YUAN, Ze
  • 朱林 ZHU, Lin
  • 陈鑫 CHEN, Xin
  • 胡康军 HU, Kangjun
  • 李贺 LI, He
Agents
  • 广州三环专利商标代理有限公司 SCIHEAD IP LAW FIRM
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) FLEXIBLE PANEL AND METHOD FOR MANUFACTURING SAME
(FR) PANNEAU FLEXIBLE ET PROCÉDÉ DESTINÉ À LE FABRIQUER
(ZH) 柔性面板及柔性面板制作方法
Abstract
(EN)
The present application provides a flexible panel and a method for manufacturing same. The flexible panel (100) comprises a substrate (10) and an electronic device (20). The substrate (10) is provided with a binding area (11). The part of the substrate (10) connected to the binding area (11) is hardened to form a hard part (12). The electronic device (20) is fixed to the substrate (10). The electronic device (20) is connected to a wire (30) extending to the binding area (11). The hard part (12) provides stress reinforcement to the binding area (11), so that the binding area (11) is not easily deformed, preventing the failure of connection between the wire (30) connecting the electronic device (20) and a functional element at the binding area (11), thereby improving the function stability of the flexible panel (100).
(FR)
La présente invention concerne un panneau flexible et un procédé destiné à le fabriquer. Le panneau flexible (100) comprend un substrat (10) et un dispositif électronique (20). Le substrat (10) comportant une zone de soudage (11). La partie du substrat (10) connectée à la zone de soudage (11) est durcie pour former une partie dure (12). Le dispositif électronique (20) est fixé au substrat (10). Le dispositif électronique (20) est connecté à un câble (30) s’étendant vers la zone de soudage (11). La partie dure (12) exerce un renforcement de contrainte sur la zone de soudage (11), de sorte que la zone de soudage (11) n’est pas facilement déformée, empêchant l’échec de connexion entre le câble (30) connectant le dispositif électronique (20) et un élément fonctionnel au niveau de la zone de soudage (11), améliorant ainsi la stabilité de fonction du panneau flexible (100).
(ZH)
本申请提供一种柔性面板及柔性面板制作方法,所述柔性面板(100)包括基材(10)和电子器件(20),所述基材(10)设有绑定区(11),所述基材(10)在连接所述绑定区(11)处硬化处理形成硬质部(12),所述电子器件(20)固定于所述基材(10),所述电子器件(20)与延伸至所述绑定区(11)的导线(30)连接。硬质部(12)对绑定区(11)提供应力补强,使得绑定区(11)不易产生变形,防止连接电子器件(20)的导线(30)在绑定区(11)与功能元件连接失效,提高了柔性面板(100)的功能稳定性。
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