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1. WO2020118279 - OPTOELECTRONIC ASSEMBLY

Publication Number WO/2020/118279
Publication Date 11.06.2020
International Application No. PCT/US2019/065105
International Filing Date 06.12.2019
IPC
H01S 5/022 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
H01S 5/042 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
04Processes or apparatus for excitation, e.g. pumping
042Electrical excitation
H01S 5/183 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
10Construction or shape of the optical resonator
18Surface-emitting lasers
183having a vertical cavity
H01S 5/024 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
024Cooling arrangements
H01S 5/06 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
06Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
H01S 5/42 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02-H01S5/30128
42Arrays of surface emitting lasers
CPC
G01S 17/00
GPHYSICS
01MEASURING; TESTING
SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
17Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
G11B 2007/0006
GPHYSICS
11INFORMATION STORAGE
BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
7Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation ; by modifying optical properties or the physical structure; , reproducing using an optical beam at lower power ; by sensing optical properties; Record carriers therefor;
0003Recording, reproducing or erasing systems characterised by the structure or type of the carrier
0006adapted for scanning different types of carrier, e.g. CD & DVD
G11B 7/0062
GPHYSICS
11INFORMATION STORAGE
BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
7Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation ; by modifying optical properties or the physical structure; , reproducing using an optical beam at lower power ; by sensing optical properties; Record carriers therefor;
004Recording, reproducing or erasing methods; Read, write or erase circuits therefor
006Overwriting
0062Overwriting strategies, e.g. recording pulse sequences with erasing level used for phase-change media
G11B 7/126
GPHYSICS
11INFORMATION STORAGE
BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
7Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation ; by modifying optical properties or the physical structure; , reproducing using an optical beam at lower power ; by sensing optical properties; Record carriers therefor;
12Heads, e.g. forming of the optical beam spot or modulation of the optical beam
125Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
126Circuits, methods or arrangements for laser control or stabilisation
H01L 2224/08145
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
07Structure, shape, material or disposition of the bonding areas after the connecting process
08of an individual bonding area
081Disposition
0812the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
08135the bonding area connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
08145the bodies being stacked
H01L 2224/16145
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16135the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
16145the bodies being stacked
Applicants
  • FINISAR CORPORATION [US]/[US]
Inventors
  • ALLOUCHE, David
  • CHU, Michael
  • CAREY, Brian, R.
  • ASHBROOK, Jonathan
  • CHAN, Anita
  • SZCZERBA, Krzysztof
Agents
  • MASCHOFF, Eric, L.
  • CALL, David, T.
  • BARBER, Daniel, R.
  • BRAITHWAITE, Jared, J.
  • BENNS, Jonathan, M.
Priority Data
62/776,44006.12.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) OPTOELECTRONIC ASSEMBLY
(FR) ENSEMBLE OPTOÉLECTRONIQUE
Abstract
(EN)
An optoelectronic assembly is disclosed. The disclosed assembly includes one or more lasers formed on a first substrate, and a programmable driver circuit formed on a second substrate configured as an integrated circuit. The first and second substrates are mounted on a third substrate in a stacked arrangement.
(FR)
La présente invention concerne un ensemble optoélectronique. L'ensemble de la présente invention comprend un ou plusieurs lasers formés sur un premier substrat, et un circuit d'attaque programmable formé sur un deuxième substrat conçu sous la forme d'un circuit intégré. Les premier et deuxième substrats sont montés sur un troisième substrat selon un agencement empilé.
Latest bibliographic data on file with the International Bureau