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1. WO2020118269 - METHOD FOR 3D-SHAPED MULTIPLE-LAYERED ELECTRONICS WITH ULTRASONIC VOXEL MANUFACTURING

Publication Number WO/2020/118269
Publication Date 11.06.2020
International Application No. PCT/US2019/065090
International Filing Date 06.12.2019
IPC
H05K 3/12 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12using printing techniques to apply the conductive material
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 3/46 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
B29C 64/10 2017.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
64Additive manufacturing, i.e. manufacturing of three-dimensional objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
10Processes of additive manufacturing
B29C 64/20 2017.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
64Additive manufacturing, i.e. manufacturing of three-dimensional objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
20Apparatus for additive manufacturing; Details thereof or accessories therefor
B33Y 10/00 2015.01
BPERFORMING OPERATIONS; TRANSPORTING
33ADDITIVE MANUFACTURING TECHNOLOGY
YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
10Processes of additive manufacturing
CPC
H05K 3/043
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
04the conductive material being removed mechanically, e.g. by punching
043by using a moving tool for milling or cutting the conductive material
H05K 3/4038
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
4038Through-connections; Vertical interconnect access [VIA] connections
Applicants
  • INTERLOG CORPORATION [US]/[US]
Inventors
  • KIM, Nathanael K.
  • PARK, Jason G.
  • KWON, Justin
Agents
  • LEE, Harry
Priority Data
62/777,00607.12.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD FOR 3D-SHAPED MULTIPLE-LAYERED ELECTRONICS WITH ULTRASONIC VOXEL MANUFACTURING
(FR) PROCÉDÉ POUR UNE ÉLECTRONIQUE MULTICOUCHE EN 3D AVEC FABRICATION DE VOXELS PAR ULTRASONS
Abstract
(EN)
A method for printing electrically conductive traces on a non-conductive material includes: printing a conductive material onto a non-conductive material by transferring ultrasonic energy to the conductive material; forming non-conductive resin on the non-conductive material on which the conductive material has been printed, using a three-dimensional printer head, the non-conductive resin being (or serving as) an insulation component, or placing a prepreg on the non-conductive material on which the conductive material has been printed; and forming a connecting portion or via hole in the non-conductive resin or the prepreg.
(FR)
L'invention concerne un procédé d'impression de traces électroconductrices sur un matériau non conducteur qui comprend : l'impression d'un matériau conducteur sur un matériau non conducteur par transfert d'énergie ultrasonore au matériau conducteur ; la formation d'une résine non conductrice sur le matériau non conducteur sur lequel le matériau conducteur a été imprimé, à l'aide d'une tête d'imprimante tridimensionnelle, la résine non conductrice étant un (ou servant de) composant d'isolation, ou la mise en place d'un préimprégné sur le matériau non conducteur sur lequel le matériau conducteur a été imprimé ; et la formation d'une partie de liaison ou d'un trou d'interconnexion dans la résine non conductrice ou le préimprégné.
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