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1. WO2020118125 - LOOSELY COUPLED INSPECTION AND METROLOGY SYSTEM FOR HIGH-VOLUME PRODUCTION PROCESS MONITORING

Publication Number WO/2020/118125
Publication Date 11.06.2020
International Application No. PCT/US2019/064805
International Filing Date 06.12.2019
IPC
G01N 21/59 2006.01
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
17Systems in which incident light is modified in accordance with the properties of the material investigated
59Transmissivity
H01L 21/66 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66Testing or measuring during manufacture or treatment
G01B 11/02 2006.01
GPHYSICS
01MEASURING; TESTING
BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11Measuring arrangements characterised by the use of optical means
02for measuring length, width, or thickness
CPC
G01N 21/9501
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws or contamination
95characterised by the material or shape of the object to be examined
9501Semiconductor wafers
G01N 2201/126
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
2201Features of devices classified in G01N21/00
12Circuits of general importance; Signal processing
126Microprocessor processing
G01N 2223/305
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
2223Investigating materials by wave or particle radiation
30Accessories, mechanical or electrical features
305computer simulations
G01N 2223/306
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
2223Investigating materials by wave or particle radiation
30Accessories, mechanical or electrical features
306computer control
G01N 23/201
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
23Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00G01N17/00, G01N21/00 or G01N22/00
20by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
201by measuring small-angle scattering
G01Q 30/04
GPHYSICS
01MEASURING; TESTING
QSCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
30Auxiliary means serving to assist or improve the scanning probe techniques or apparatus, e.g. display or data processing devices
04Display or data processing devices
Applicants
  • KLA CORPORATION [US]/[US]
Inventors
  • WU, Song
  • XU, Yin
  • SHCHEGROV, Andrei
  • LEE, Lie-Quan Rich
  • ROVIRA, Pablo
  • MADSEN, Jon
Agents
  • MCANDREWS, Kevin
  • MORRIS, Elizabeth M.N.
Priority Data
16/287,52327.02.2019US
62/776,29206.12.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) LOOSELY COUPLED INSPECTION AND METROLOGY SYSTEM FOR HIGH-VOLUME PRODUCTION PROCESS MONITORING
(FR) SYSTÈME D'INSPECTION ET DE MÉTROLOGIE À COUPLAGE LÂCHE POUR SURVEILLANCE DE PROCESSUS DE PRODUCTION DE GRAND VOLUME
Abstract
(EN)
A metrology system is disclosed. In one embodiment, the metrology system includes a controller communicatively coupled to a reference metrology tool and an optical metrology tool, the controller including one or more processors configured to: generate a geometric model for determining a profile of a test HAR structure from metrology data from a reference metrology tool; generate a material model for determining one or more material parameters of a test HAR structure from metrology data from the optical metrology tool; form a composite model from the geometric model and the material model; measure at least one additional test HAR structure with the optical metrology tool; and determine a profile of the at least one additional test HAR structure based on the composite model and metrology data from the optical metrology tool associated with the at least one HAR test structure.
(FR)
L'invention concerne un système de métrologie. Selon un mode de réalisation, le système de métrologie comprend un dispositif de commande couplé en communication à un outil de métrologie de référence et à un outil de métrologie optique, le dispositif de commande comprenant un ou plusieurs processeurs configurés pour : générer un modèle géométrique pour déterminer un profil d'une structure HAR d'essai à partir de données de métrologie d'un outil de métrologie de référence ; générer un modèle de matériau pour déterminer un ou plusieurs paramètres de matériau d'une structure HAR d'essai à partir de données de métrologie de l'outil de métrologie optique ; former un modèle composite à partir du modèle géométrique et du modèle de matériau ; mesurer au moins une structure HAR d'essai supplémentaire avec l'outil de métrologie optique ; et déterminer un profil de ladite au moins une structure HAR d'essai supplémentaire sur la base du modèle composite et des données de métrologie de l'outil de métrologie optique associé à ladite au moins une structure d'essai HAR.
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