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1. WO2020117600 - ESTIMATING THE TEMPERATURE OF A MEMORY SUB-SYSTEM

Publication Number WO/2020/117600
Publication Date 11.06.2020
International Application No. PCT/US2019/063740
International Filing Date 27.11.2019
IPC
G06F 3/06 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
06Digital input from, or digital output to, record carriers
G11C 7/04 2006.01
GPHYSICS
11INFORMATION STORAGE
CSTATIC STORES
7Arrangements for writing information into, or reading information out from, a digital store
04with means for avoiding disturbances due to temperature effects
CPC
G06F 1/206
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
20Cooling means
206comprising thermal management
G06F 3/0653
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
06Digital input from or digital output to record carriers, ; e.g. RAID, emulated record carriers, networked record carriers
0601Dedicated interfaces to storage systems
0628making use of a particular technique
0653Monitoring storage devices or systems
G06F 3/0683
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
06Digital input from or digital output to record carriers, ; e.g. RAID, emulated record carriers, networked record carriers
0601Dedicated interfaces to storage systems
0668adopting a particular infrastructure
0671In-line storage system
0683Plurality of storage devices
Applicants
  • MICRON TECHNOLOGY, INC. [US]/[US]
Inventors
  • HOLMSTROM, David A.
  • YANG, Jui-Yao
  • AKIN, William
Agents
  • PORTNOVA, Marina
  • KRUEGER, Paul M.
  • TAM, Steven K.
  • ANDREEV, Dmitry
Priority Data
16/208,31903.12.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ESTIMATING THE TEMPERATURE OF A MEMORY SUB-SYSTEM
(FR) ESTIMATION DE LA TEMPÉRATURE D'UN SOUS-SYSTÈME DE MÉMOIRE
Abstract
(EN)
A request for an estimated temperature of a memory sub-system including multiple components can be received. A set of component temperature values based on temperature measurements at the components can be identified. A subset of the component temperature values can be generated by removing one or more of the component temperature values from the set of component temperature values based on one or more criteria. The estimated temperature value that estimates the temperature of the memory sub-system can be generated using the subset of the component temperature values.
(FR)
Une demande concernant une température estimée d'un sous-système de mémoire comprenant de multiples composants peut être reçue. Un ensemble de valeurs de température de composants basé sur des mesures de température au niveau des composants peut être identifié. Un sous-ensemble des valeurs de température de composants peut être généré en éliminant une ou plusieurs valeurs de température de composants de l'ensemble de valeurs de température de composants en fonction d'un ou de plusieurs critères. La valeur de température estimée qui estime la température du sous-système de mémoire peut être générée à l'aide du sous-ensemble des valeurs de température de composants.
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