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1. WO2020117326 - PROVISIONING DATA CENTER SERVER COOLING EQUIPMENT

Publication Number WO/2020/117326
Publication Date 11.06.2020
International Application No. PCT/US2019/044409
International Filing Date 31.07.2019
IPC
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
H05K 7/20145
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20009using a gaseous coolant in electronic enclosures
20136Forced ventilation, e.g. by fans
20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
H05K 7/20272
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20218using a liquid coolant without phase change in electronic enclosures
20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
H05K 7/20281
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20218using a liquid coolant without phase change in electronic enclosures
20281Thermal management, e.g. liquid flow control
H05K 7/20736
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks
20718Forced ventilation of a gaseous coolant
20736within cabinets for removing heat from server blades
H05K 7/20781
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks
20763Liquid cooling without phase change
20781within cabinets for removing heat from server blades
H05K 7/20827
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks
208Liquid cooling with phase change
20827within rooms for removing heat from cabinets, e.g. air conditioning devices
Applicants
  • GOOGLE LLC [US]/[US]
Inventors
  • CHIU, Jerry
  • SALMAN, Skyler
  • IYENGAR, Madhusudan Krishnan
Agents
  • WERNLI, Matthew K.
Priority Data
16/250,41817.01.2019US
62/775,51305.12.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PROVISIONING DATA CENTER SERVER COOLING EQUIPMENT
(FR) APPROVISIONNEMENT D'ÉQUIPEMENT DE REFROIDISSEMENT DE SERVEUR DE CENTRE DE DONNÉES
Abstract
(EN)
Systems and methods for data center liquid cooling apparatus provisioning are described. In some aspects, such systems and methods may provision one or more data center liquid cooling apparatus, e.g., prior to such apparatus being put into service to a data center to cool data center devices, such as server trays (and more specifically, heat-generating devices such as processors, memories, voltage regulators, and other devices mounted on motherboards of the server trays). In some aspects, such liquid cooling apparatus include cold plates or evaporators that are mounted in thermal communication with the heat generating devices (in the server trays) and utilize a flow of a cooling liquid (e.g., water, glycol, refrigerant) to remove heat from the server tray (e.g., with or without a phase change of the cooling liquid).
(FR)
L'invention concerne des systèmes et des procédés d'approvisionnement d'appareil de refroidissement par liquide de centre de données. Selon certains aspects, de tels systèmes et procédés peuvent fournir un ou plusieurs appareils de refroidissement par liquide de centre de données, par exemple, avant qu'un tel appareil soit mis en service vers un centre de données pour refroidir des dispositifs de centre de données, tels que des plateaux de serveur (et plus spécifiquement, des dispositifs de génération de chaleur tels que des processeurs, des mémoires, des régulateurs de tension, et d'autres dispositifs montés sur des cartes mères des plateaux de serveur). Selon certains aspects, un tel appareil de refroidissement par liquide comprend des plaques froides ou des évaporateurs qui sont montés en communication thermique avec les dispositifs de génération de chaleur (dans les plateaux de serveur) et utiliser un flux d'un liquide de refroidissement (par exemple, de l'eau, du glycol, du réfrigérant) pour éliminer la chaleur du plateau de serveur (par exemple, avec ou sans changement de phase du liquide de refroidissement).
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