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1. WO2020117263 - HOUSINGS FOR ELECTRONIC DEVICES

Publication Number WO/2020/117263
Publication Date 11.06.2020
International Application No. PCT/US2018/064410
International Filing Date 07.12.2018
IPC
G06F 1/16 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/-G06F13/82
16Constructional details or arrangements
B32B 33/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
33Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
B44C 1/175 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
44DECORATIVE ARTS
CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
1Processes, not specifically provided for elsewhere, for producing decorative surface effects
16for applying transfer pictures or the like
165for decalcomanias; Sheet materials therefor
175Transfer using solvent
CPC
B32B 33/00
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
33Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
B44C 1/175
BPERFORMING OPERATIONS; TRANSPORTING
44DECORATIVE ARTS
CPRODUCING DECORATIVE EFFECTS
1Processes, not specifically provided for elsewhere, for producing decorative surface effects
16for applying transfer pictures or the like
165for decalcomanias; sheet material therefor
175Transfer using solvent
G06F 1/16
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
Applicants
  • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. [US]/[US]
Inventors
  • CHANG, Chi Hao
  • WU, Kuan-Ting
  • LIN, Yu Ling
Agents
  • COSTALES, Shruti S
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) HOUSINGS FOR ELECTRONIC DEVICES
(FR) BOÎTIERS POUR DISPOSITIFS ÉLECTRONIQUES
Abstract
(EN)
The present disclosure relates to a housing for an electronic device. The housing comprises a substrate, a primer layer overlying at least part of the substrate; and a water transfer print layer overlying at least part of the primer layer. The substrate comprises at least one of (i) a metal or metal alloy substrate having an oxide layer and/or passivation layer, (ii) a fibre composite substrate, and (iii) a polymer composite substrate comprising a first polymer region and a second polymer region. Where the substrate comprises the polymer composite, the primer layer overlies at least part of a join between the first polymer region and the second polymer region. In some examples, the primer layer may not only overly the join between the first polymer region and the second polymer region but may also overly at least part of the surface of the first polymer region and the second polymer region
(FR)
La présente invention porte sur un boîtier pour un dispositif électronique. Le boîtier comprend un substrat, une couche d'apprêt recouvrant au moins une partie du substrat ; et une couche d'impression de transfert d'eau recouvrant au moins une partie de la couche d'apprêt. Le substrat comprend au moins l'un parmi (i) un substrat en métal ou en alliage métallique ayant une couche d'oxyde et/ou une couche de passivation, (ii) un substrat composite à base de fibres, et (iii) un substrat composite polymère comprenant une première région polymère et une seconde région polymère. Lorsque le substrat comprend le composite polymère, la couche d'apprêt recouvre au moins une partie d'une jonction entre la première région polymère et la seconde région polymère. Dans certains exemples, la couche d'apprêt peut non seulement recouvrir la jonction entre la première région de polymère et la seconde région de polymère mais peut également recouvrir au moins une partie de la surface de la première région de polymère et de la seconde région de polymère.
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