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1. WO2020117049 - MANUFACTURE OF A CURVED ELECTRONIC DEVICE USING DIFFERENTIAL HEATING AND CURVED ELECTRONIC DEVICE

Publication Number WO/2020/117049
Publication Date 11.06.2020
International Application No. PCT/NL2019/050796
International Filing Date 02.12.2019
IPC
H05K 1/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
CPC
H05K 1/0278
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0277Bendability or stretchability details
0278Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
H05K 1/0284
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0284Details of three-dimensional rigid printed circuit boards
H05K 2201/0112
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0104Properties and characteristics in general
0112Absorbing light, e.g. dielectric layer with carbon filler for laser processing
H05K 2201/0129
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0104Properties and characteristics in general
0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
H05K 2201/0187
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0183Dielectric layers
0187with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
H05K 2201/0191
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0183Dielectric layers
0191wherein the thickness of the dielectric plays an important role
Applicants
  • NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO [NL]/[NL]
Inventors
  • DE KOK, Margaretha Maria
  • KUSTERS, Roel Henry Louis
  • VAN DELFT, Jan Pieter Hein
  • SCHRAM, Jeroen Franciscus Marinus
  • VAN DER WAAL, Adri
  • RUBINGH, Jan-Eric Jack Martijn
  • VAN DEN BRAND, Jeroen
Agents
  • WITMANS, H.A.
Priority Data
18209756.803.12.2018EP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) MANUFACTURE OF A CURVED ELECTRONIC DEVICE USING DIFFERENTIAL HEATING AND CURVED ELECTRONIC DEVICE
(FR) FABRICATION D'UN DISPOSITIF ÉLECTRONIQUE INCURVÉ À L'AIDE D'UN CHAUFFAGE DIFFÉRENTIEL ET DISPOSITIF ÉLECTRONIQUE INCURVÉ
Abstract
(EN)
A curved electronic device (10c) can be formed by a stack with a curved substrate (13) comprising a thermoplastic material (Ms), and at least one electronic component (14) connected to an electronic circuit (15) disposed on the substrate (13). A component area (11) of the substrate surface (11.12) around the electronic component (14) comprises a first material (Ml) providing relatively low absorption (Al) to light (L). and a surrounding area (12) of the substrate (13). outside the component area (11), comprises a second material (M2) providing relatively high absorption (A2) of the light (L). E.g. as a result of differential heating and thermoforming a first thickness (Tl) of the substrate (13) in the component area (11) may be relatively high compared to a second thickness (T2) of the substrate (13) in the surrounding area (12).
(FR)
Dispositif électronique incurvé (10c) pouvant être formé par un empilement présentant un substrat incurvé (13) comprenant un matériau thermoplastique (Ms) et au moins un composant électronique (14) connecté à un circuit électronique (15) disposé sur le substrat (13). Une zone de composants (11) de la surface de substrat (11.12) autour du composant électronique (14) comprend un premier matériau (Ml) fournissant une absorption relativement faible (Al) de la lumière (L), et une zone environnante (12) du substrat (13) à l'extérieur de la zone de composants (11) comprend un second matériau (M2) fournissant une absorption relativement élevée (A2) de la lumière (L). Par exemple, suite à un chauffage différentiel et un thermoformage, une première épaisseur (Tl) du substrat (13) dans la zone de composants (11) peut être relativement élevée par rapport à une seconde épaisseur (T2) du substrat (13) dans la zone environnante (12).
Also published as
Latest bibliographic data on file with the International Bureau