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1. WO2020117005 - ELECTRONIC DEVICE WITH BONDING STRUCTURE

Publication Number WO/2020/117005
Publication Date 11.06.2020
International Application No. PCT/KR2019/017216
International Filing Date 06.12.2019
IPC
G06F 1/16 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/-G06F13/82
16Constructional details or arrangements
C09J 133/08 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
04Homopolymers or copolymers of esters
06of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
08Homopolymers or copolymers of acrylic acid esters
C09J 183/04 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04Polysiloxanes
C09J 175/04 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
175Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
04Polyurethanes
C09J 163/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
CPC
G06F 1/1626
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
1613for portable computers
1626with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
G06F 1/1637
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
1613for portable computers
1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
1637Details related to the display arrangement, including those related to the mounting of the display in the housing
G06F 1/1656
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
1613for portable computers
1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
1656Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
Applicants
  • SAMSUNG ELECTRONICS CO., LTD. [KR]/[KR]
Inventors
  • PARK, Daehyeong
  • CHOI, Jongmin
  • KIM, Jaehee
  • KIM, Jongkeun
  • KIM, Hun
  • BYUN, Donghyun
  • JEONG, Uyhyeon
  • JUNG, Iksu
  • CHO, Sunggun
  • CHO, Chongkun
  • CHOI, Wonhee
  • HWANG, Seunghyun
  • YOON, Byounguk
  • LEE, Minsung
Agents
  • KWON, Hyuk-Rok
  • LEE, Jeong-Soon
Priority Data
10-2018-015572406.12.2018KR
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ELECTRONIC DEVICE WITH BONDING STRUCTURE
(FR) DISPOSITIF ÉLECTRONIQUE AVEC STRUCTURE DE LIAISON
Abstract
(EN)
An electronic device is provided that includes a housing including a front plate facing a first direction, a rear plate facing a second direction opposite to the first direction, and a lateral member surrounding a space between the front plate and the rear plate and at least partially constructed of a metal material, wherein the front plate includes a first edge having a first length and extending in a third direction, a second edge having a second length longer than the first length and extending in a fourth direction orthogonal to the third direction, a third edge parallel to the first edge, having the first length, and extending in the third direction from the second edge, a fourth edge parallel to the second edge, having the second length, and extending in the fourth direction from the first edge, a first region in which the third edge and the fourth edge meet, and a second region in which the second edge and the third edge meet, a display viewable through the front plate, and an adhesive layer constructed in a closed-curve shape along the first edge, second edge, third edge, and fourth edge of the front plate, wherein, when viewed from above the display, a width of the adhesive layer in the first region and the second region is greater than a width of the adhesive layer outside the first region and the second region.
(FR)
L'invention concerne un dispositif électronique qui comprend un boîtier comprenant une plaque avant faisant face à une première direction, une plaque arrière faisant face à une seconde direction opposée à la première direction, et un élément latéral entourant un espace entre la plaque avant et la plaque arrière et au moins partiellement constitué d'un matériau métallique, la plaque avant comprenant un premier bord ayant une première longueur et s'étendant dans une troisième direction, un deuxième bord ayant une deuxième longueur plus longue que la première longueur et s'étendant dans une quatrième direction orthogonale à la troisième direction, un troisième bord parallèle au premier bord, ayant la première longueur, et s'étendant dans la troisième direction à partir du second bord, un quatrième bord parallèle au second bord, ayant la seconde longueur, et s'étendant dans la quatrième direction à partir du premier bord, une première région dans laquelle le troisième bord et le quatrième bord se rencontrent, et une seconde région dans laquelle le second bord et le troisième bord se rencontrent, un dispositif d'affichage visible à travers la plaque avant, et une couche adhésive construite en forme de courbe fermée le long du premier bord, un deuxième bord, un troisième bord et un quatrième bord de la plaque avant, dans lequel, vue depuis le dessus du dispositif d'affichage, une largeur de la couche adhésive dans la première région et la seconde région est supérieure à une largeur de la couche adhésive à l'extérieur de la première région et de la seconde région.
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