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1. WO2020116806 - SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

Publication Number WO/2020/116806
Publication Date 11.06.2020
International Application No. PCT/KR2019/015305
International Filing Date 12.11.2019
IPC
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
H01L 21/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
CPC
H01L 21/02052
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
02041Cleaning
02043Cleaning before device manufacture, i.e. Begin-Of-Line process
02052Wet cleaning only
H01L 21/02343
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
02104Forming layers
02107Forming insulating materials on a substrate
02296characterised by the treatment performed before or after the formation of the layer
02318post-treatment
02343treatment by exposure to a liquid
H01L 21/67028
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
H01L 21/6715
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
6715Apparatus for applying a liquid, a resin, an ink or the like
H01L 21/67248
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67242Apparatus for monitoring, sorting or marking
67248Temperature monitoring
H01L 21/68721
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68714the wafers being placed on a susceptor, stage or support
68721characterised by edge clamping, e.g. clamping ring
Applicants
  • 주식회사 테스 TES CO.,LTD [KR]/[KR]
Inventors
  • 주정명 JU, Jung-Myoung
  • 박상준 PARK, Sang-Joon
  • 오승민 OH, Seung-Min
  • 이준희 LEE, Joon-Hee
Agents
  • 이재홍 LEE, Jae-Hong
Priority Data
10-2018-015513705.12.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
(FR) DISPOSITIF DE TRAITEMENT DE SUBSTRAT ET PROCÉDÉ DE TRAITEMENT DE SUBSTRAT
(KO) 기판처리장치 및 기판처리방법
Abstract
(EN)
The present invention relates to a substrate processing device and a substrate processing method capable of reducing and preventing damage to an O-ring for sealing a chamber, which process a substrate by using a supercritical fluid. The substrate processing device comprises: a chamber having a chamber body, which provides a processing space in which the substrate is processed, and a chamber lid, which seals the opening of the chamber body; a fluid supply unit for supplying a main fluid to the inside of the chamber; an O-ring unit arranged between the chamber lid and the chamber body so as to seal the inside of the chamber; and a fluid supply blocking unit for providing a blocking area that blocks the connection between the O-ring unit and the processing space.
(FR)
La présente invention concerne un dispositif de traitement de substrat et un procédé de traitement de substrat aptes à réduire et à empêcher un endommagement d'un joint torique pour étanchéifier une chambre, qui traitent un substrat à l'aide d'un fluide supercritique. Le dispositif de traitement de substrat comprend : une chambre ayant un corps de chambre, qui fournit un espace de traitement dans lequel le substrat est traité, et un couvercle de chambre, qui scelle l'ouverture du corps de chambre ; une unité d'alimentation en fluide pour fournir un fluide principal à l'intérieur de la chambre ; une unité de joint torique disposée entre le couvercle de chambre et le corps de chambre de façon à étanchéifier l'intérieur de la chambre ; et une unité de blocage d'alimentation en fluide pour fournir une zone de blocage qui bloque la connexion entre l'unité de joint torique et l'espace de traitement.
(KO)
본 발명은 챔버를 밀폐시키는 오링의 손상을 줄이고 방지할 수 있는, 초임계유체를 이용하여 기판에 대한 처리공정을 수행하는 기판처리장치 및 기판처리방법에 대한 것이다. 상기 기판처리장치는 기판에 대한 처리공정을 수행하는 처리공간을 제공하는 챔버몸체와, 챔버몸체의 개구부를 밀폐하는 챔버리드를 구비하는 챔버; 챔버 내부로 메인유체를 공급하는 유체공급부; 챔버리드와 챔버몸체 사이에 배치되어 챔버 내부를 실링하는 오링유닛; 및 오링유닛이 처리공간과 연통되는 것을 차단하는 차단영역을 제공하는 차단유체공급부;를 구비한다.
Also published as
Latest bibliographic data on file with the International Bureau