Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020116788 - DICYCLOPENTADIENE-BASED RESIN, DICYCLOPENTADIENE-BASED HYDROGENATED RESIN, AND ADHESIVE RESIN COMPOSITION COMPRISING SAME

Publication Number WO/2020/116788
Publication Date 11.06.2020
International Application No. PCT/KR2019/014534
International Filing Date 31.10.2019
IPC
C08F 232/06 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
232Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
02having no condensed rings
06having two or more carbon-to-carbon double bonds
C08F 226/02 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
226Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
02by a single or double bond to nitrogen
C08F 8/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
8Chemical modification by after-treatment
04Reduction, e.g. hydrogenation
C09J 191/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
191Adhesives based on oils, fats or waxes; Adhesives based on derivatives thereof
C09J 109/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
109Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
Applicants
  • 한화솔루션 주식회사 HANWHA SOLUTIONS CORPORATION [KR]/[KR]
Inventors
  • 강현욱 KANG, Hyeonuk
  • 변도현 BYUN, Do Hyun
  • 윤경준 YOON, Kyongjun
Agents
  • 특허법인 플러스 PLUS INTERNATIONAL IP LAW FIRM
Priority Data
10-2018-015489605.12.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) DICYCLOPENTADIENE-BASED RESIN, DICYCLOPENTADIENE-BASED HYDROGENATED RESIN, AND ADHESIVE RESIN COMPOSITION COMPRISING SAME
(FR) RÉSINE À BASE DE DICYCLOPENTADIENE, RÉSINE HYDROGÉNÉE À BASE DE DICYCLOPENTADIENE ET COMPOSITION DE RÉSINE ADHÉSIVE LA COMPORTANT
(KO) 디사이클로펜타디엔계 수지, 디사이클로펜타디엔계 수첨 수지 및 이를 포함하는 접착수지 조성물
Abstract
(EN)
The present invention relates to: a dicyclopentadiene-based resin having excellent compatibility with a base resin and prepared by being copolymerized with a monomer composition comprising a dicyclopentadiene-based monomer and a vinylamide-based monomer; a dicyclopentadiene-based hydrogenated resin; and an adhesive resin composition comprising same. A dicyclopentadiene-based resin according to the present invention is advantageous in terms of having excellent compatibility with various base resins and being providable as an adhesive resin composition capable of achieving remarkably improved adhesive strength.
(FR)
La présente invention concerne : une résine à base de dicyclopentadiène qui présente une excellente compatibilité avec une résine de base et qui est préparée par copolymérisation avec une composition de monomères comportant un monomère à base de dicyclopentadiène et un monomère à base de vinylamide ; une résine hydrogénée à base de dicyclopentadiène ; une composition de résine adhésive la comportant. Une résine à base de dicyclopentadiène selon la présente invention est avantageuse, en ce sens que ladite résine présente une excellente compatibilité avec différentes résines de base et peut être fournie en tant que composition de résine adhésive pouvant atteindre une force d'adhérence remarquablement améliorée.
(KO)
본 발명은 베이스 수지와의 상용성이 우수한 디사이클로펜타디엔계 단량체 및 비닐아마이드계 단량체를 포함하는 단량체 조성물로 공중합하여 제조되는 디사이클로펜타디엔계 수지, 디사이클로펜타디엔계 수첨 수지 및 이를 포함하는 접착수지 조성물에 관한 것이다. 본 발명에 따른 디사이클로펜타디엔계 수지는 다양한 베이스 수지와의 우수한 상용성을 가지고, 현저히 향상된 접착력을 구현할 수 있는 접착수지 조성물로 제공할 수 있다는 장점이 있다.
Latest bibliographic data on file with the International Bureau