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1. WO2020116779 - FLEXIBLE SURFACE LIGHT-EMITTING ILLUMINATION DEVICE

Publication Number WO/2020/116779
Publication Date 11.06.2020
International Application No. PCT/KR2019/014107
International Filing Date 25.10.2019
IPC
C08K 9/06 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
9Use of pretreated ingredients
04Ingredients treated with organic substances
06with silicon-containing compounds
C08K 3/22 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
22of metals
C08L 81/02 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
81Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
02Polythioethers; Polythioether-ethers
C08L 77/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
C08L 67/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
67Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
C08L 69/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
69Compositions of polycarbonates; Compositions of derivatives of polycarbonates
CPC
C08K 3/22
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
22of metals
C08K 5/5415
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
54Silicon-containing compounds
541containing oxygen
5415containing at least one Si—O bond
C08K 5/544
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
54Silicon-containing compounds
544containing nitrogen
C08K 7/14
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
7Use of ingredients characterised by shape
02Fibres or whiskers
04inorganic
14Glass
C08K 9/06
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
9Use of pretreated ingredients
04Ingredients treated with organic substances
06with silicon-containing compounds
C08L 67/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
67Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain
Applicants
  • 주식회사 동성코퍼레이션 DONGSUNG CORPORATION [KR]/[KR]
Inventors
  • 권도현 KWON, Do Hyun
  • 이재욱 LEE, Jae Wook
  • 이진성 LEE, Jin Seong
  • 김경민 KIM, Kyung Min
Agents
  • 특허법인뉴코리아 NEWKOREA PATENT & LAW FIRM
Priority Data
10-2018-015722207.12.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) FLEXIBLE SURFACE LIGHT-EMITTING ILLUMINATION DEVICE
(FR) DISPOSITIF D'ÉCLAIRAGE ÉLECTROLUMINESCENT À SURFACE SOUPLE
(KO) 플렉서블 면발광 조명 장치
Abstract
(EN)
The present invention relates to a flexible surface light-emitting illumination device and, more specifically, to a flexible surface light-emitting illumination device, and the like, the device comprising: a flexible substrate having a circuit pattern formed by three-dimensional molded interconnect device (MID) technology; a light-emitting chip mounted on the flexible substrate so as to be electrically connected to the circuit pattern; a reflection sheet stacked on the flexible substrate so that the light-emitting chip is exposed; an adhesive sheet stacked on the reflection sheet so that the light-emitting chip is exposed; a molding member stacked on the adhesive sheet so as to seal the light-emitting chip; and a driving connector coupled to the flexible substrate so as to apply a driving signal to the light-emitting chip. The present invention has an effect of providing a flexible surface light-emitting illumination device using three-dimensional MID technology, and the like, the device applying the MID technology to a laser-sensitive polymer-based material so as to enable cost reduction and the lightening of products through the elimination of a PCB.
(FR)
La présente invention concerne un dispositif d'éclairage électroluminescent à surface souple et, plus spécifiquement, un dispositif d'éclairage électroluminescent à surface souple, et similaire, le dispositif comprenant : un substrat souple ayant un motif de circuit formé par une technologie de dispositif d'interconnexion moulé tridimensionnel (MID); une puce électroluminescente montée sur le substrat souple de façon à être connectée électriquement au motif de circuit; une feuille réfléchissante empilée sur le substrat souple de telle sorte que la puce électroluminescente est exposée; une feuille adhésive empilée sur la feuille réfléchissante de telle sorte que la puce électroluminescente est exposée; un élément de moulage empilé sur la feuille adhésive de manière à rendre étanche la puce électroluminescente; et un connecteur d'excitation couplé au substrat souple de façon à appliquer un signal d'excitation à la puce électroluminescente. La présente invention a pour effet de fournir un dispositif d'éclairage électroluminescent à surface souple utilisant une technologie de MID tridimensionnel, et similaire, le dispositif appliquant la technologie de MID à un matériau à base de polymère sensible au laser de façon à réduire les coûts et alléger les produits par l'élimination d'une carte de circuits imprimés.
(KO)
본 발명은 플렉서블 면발광 조명 장치에 관한 것으로, 보다 상세하게는 3차원 MID 기술에 의해 형성된 회로패턴을 갖는 플렉서블 기재; 상기 플렉서블 기재 상에 실장되어, 상기 회로패턴과 전기적으로 연결된 발광 칩; 상기 발광 칩이 노출되도록 플렉서블 기재 상에 적층된 반사 시트; 상기 발광 칩이 노출되도록 반사 시트 상에 적층된 점착 시트; 상기 점착 시트 상에 적층되어, 상기 발광 칩을 밀봉하는 몰딩 부재; 및 상기 플렉서블 기재에 결합되어, 상기 발광 칩으로 구동신호를 인가하기 위한 구동 커넥터;를 포함하는 플렉서블 면발광 조명 장치 등에 관한 것이다. 본 발명에 따르면, 레이저에 감응하는 고분자 기반의 소재에 MID(molded interconnect device) 기술을 적용하여, PCB의 삭제를 통한 원가절감과 제품의 무게를 경량화시킬 수 있는 3차원 MID 기술을 이용한 플렉서블 면발광 조명 장치 등을 제공하는 효과가 있다.
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