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1. WO2020116709 - BGA SOCKET DEVICE FOR SEMICONDUCTOR ELEMENT TEST

Publication Number WO/2020/116709
Publication Date 11.06.2020
International Application No. PCT/KR2018/016658
International Filing Date 26.12.2018
IPC
G01R 1/04 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02General constructional details
04Housings; Supporting members; Arrangements of terminals
G01R 1/067 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
G01R 1/073 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
073Multiple probes
G01R 31/28 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
CPC
G01R 1/0466
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
04Housings; Supporting members; Arrangements of terminals
0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
0433Sockets for IC's or transistors
0441Details
0466concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
G01R 1/0483
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
04Housings; Supporting members; Arrangements of terminals
0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
0433Sockets for IC's or transistors
0483Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
G01R 1/06733
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
06733Geometry aspects
G01R 1/07314
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
073Multiple probes
07307with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
07314the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
G01R 31/2886
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
2851Testing of integrated circuits [IC]
2886Features relating to contacting the IC under test, e.g. probe heads; chucks
H01R 13/15
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
02Contact members
15Pins, blades or sockets having separate spring member for producing or increasing contact pressure
Applicants
  • 하이콘 주식회사 HICON CO., LTD. [KR]/[KR]
  • 황동원 HWANG, Dong Weon [KR]/[KR]
  • 황로건 재 HWANG, Logan Jae [US]/[US]
  • 황재백 HWANG, Jae Baek [US]/[KR]
Inventors
  • 황동원 HWANG, Dong Weon
  • 황로건 재 HWANG, Logan Jae
  • 황재백 HWANG, Jae Baek
Agents
  • 이은철 LEE, Un Cheol
Priority Data
10-2018-015468704.12.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) BGA SOCKET DEVICE FOR SEMICONDUCTOR ELEMENT TEST
(FR) DISPOSITIF À DOUILLE BGA DESTINÉ À UN TEST D'ÉLÉMENT SEMI-CONDUCTEUR
(KO) 반도체 소자 테스트용 BGA 소켓장치
Abstract
(EN)
The present invention relates to a dual pinch-type BGA socket device used for a test of a semiconductor element, the BGA socket device comprising: a contact (100) which includes a fixed side terminal (110) and a movable side terminal (120) provided in a pair while facing each other, wherein upper tip parts (111 and 122) of the fixed side terminal (110) and the movable side terminal (120) are provided to be offset (d) from each other by a predetermined interval with reference to a ball terminal (2) therebetween; a main body part (210) at which the contact (100) is vertically and fixedly provided; a cover (230) which is provided over the main body part (210) and is elastically supported, so that the cover (230) is longitudinally movable within a predetermined range of height from the main body part (210); and a slider (240) which is provided between the main body part (210) and the cover (230), is laterally slid in connection with the longitudinal position of the cover (230) to open or close the movable side terminal (120) in the horizontal direction, and includes a fixed side terminal receiving hole (245) having the fixed side terminal (110) formed therethrough and a movable side terminal receiving hole (246) having the movable side terminal (120) formed therethrough, wherein the fixed side terminal receiving hole (245) and the movable side terminal receiving hole (246) are offset (d) from each other as much as an offset (d) between the upper tip parts (111 and 122) of the contact, and the fixed side terminal receiving hole has a length longer than that of the movable side terminal receiving hole.
(FR)
La présente invention concerne un dispositif à douille BGA de type à pincement double utilisé pour un test d'un élément semi-conducteur, le dispositif à douille BGA comprenant : un contact (100) qui comprend une borne latérale fixe (110) et une borne latérale mobile (120) disposées en paire tout en étant en regard l'une de l'autre, des parties de pointe supérieure (111 et 122) de la borne latérale fixe (110) et de la borne latérale mobile (120) étant conçus pour être décalés (d) l'un de l'autre selon un intervalle prédéterminé par rapport à une borne à bille (2) entre eux; une partie de corps principal (210) au niveau de laquelle le contact (100) est disposé verticalement et de manière fixe; un couvercle (230) situé sur la partie de corps principal (210) est maintenu élastiquement, de telle sorte que le couvercle (230) soit mobile longitudinalement dans une plage prédéterminée de hauteur depuis la partie de corps principal (210); et un curseur (240) situé entre la partie de corps principal (210) et le couvercle (230), qui est glissé latéralement en liaison avec la position longitudinale du couvercle (230) afin d'ouvrir ou de fermer la borne latérale mobile (120) dans la direction horizontale, et comprenant un trou de réception de borne latérale fixe (245) possédant la borne latérale fixe (110) formée à travers ce dernier et un trou de réception de borne latérale mobile (246) possédant la borne latérale mobile (120) formée à travers ce dernier, le trou de réception de borne latérale fixe (245) et le trou de réception de borne latérale mobile (246) étant décalés (d) l'un de l'autre selon un décalage (d) entre les parties de pointe supérieure (111 et 122) du contact, et le trou de réception de borne latérale fixe présentant une longueur supérieure à celle du trou de réception de borne latérale mobile.
(KO)
본 발명은 반도체 소자의 테스트에 사용하는 듀얼 핀치 타입(dual pinch type)의 BGA 소켓장치에 관한 것으로, 서로 대향하여 구비되는 한 쌍의 고정측 단자(110)와 가동측 단자(120)를 포함하되, 상기 고정측 단자(110)와 상기 가동측 단자(120)의 각 상측첨단부(111)(122)는 볼 단자(2)를 중심으로 하여 일정 간격 오프셋(d)되어 구비되는 콘택트(100)와; 상기 콘택트(100)가 수직하게 구비되어 고정되는 메인 몸체부(210)와; 상기 메인 몸체부(210)의 상부에서 탄성 지지되어 상기 메인 몸체부(210)에 대해 일정 높이의 범위 내에서 상하 이동 가능하게 구비되는 커버(230)와; 상기 메인 몸체부(210)와 상기 커버(230) 사이에 구비되어 상기 커버(230)의 상하 위치와 연동되어 좌우 슬라이딩이 이루어져 상기 가동측 단자(120)를 수평 방향으로 개폐 조작하며, 상기 고정측 단자(110)가 관통 위치하게 되는 고정측 단자 수용공(245)과 상기 가동측 단자(120)가 관통 위치하게 되는 가동측 단자 수용공(246)이 형성되되, 상기 고정측 단자 수용공(245)과 상기 가동측 단자 수용공(246)은 상기 콘택트의 상측첨단부(111)(122) 사이의 오프셋(d) 만큼 오프셋(d)되고 상기 고정측 단자 수용공은 상기 가동측 단자 수용공 보다 길이가 더 긴 슬라이더(240)를 포함한다.
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