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1. WO2020116539 - COATING AGENT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MODULE USING SAID COATING AGENT

Publication Number WO/2020/116539
Publication Date 11.06.2020
International Application No. PCT/JP2019/047522
International Filing Date 04.12.2019
IPC
H01L 23/29 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H01L 23/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
C09D 201/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
201Coating compositions based on unspecified macromolecular compounds
H01L 21/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
C09D 7/63 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/88; Processes for incorporating ingredients in coating compositions
40Additives
60non-macromolecular
63organic
C09D 7/65 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/88; Processes for incorporating ingredients in coating compositions
40Additives
65macromolecular
Applicants
  • 積水化学工業株式会社 SEKISUI CHEMICAL CO., LTD. [JP]/[JP]
Inventors
  • 黒住 悟 KUROZUMI Satoru
  • 井上 将男 INOUE Masao
Agents
  • 永井 浩之 NAGAI Hiroshi
  • 中村 行孝 NAKAMURA Yukitaka
  • 朝倉 悟 ASAKURA Satoru
  • 浅野 真理 ASANO Makoto
  • 堀田 幸裕 HOTTA Yukihiro
Priority Data
2018-23003907.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) COATING AGENT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MODULE USING SAID COATING AGENT
(FR) AGENT DE REVÊTEMENT ET PROCÉDÉ DE PRODUCTION D'UN MODULE DE COMPOSANT ÉLECTRONIQUE UTILISANT LEDIT AGENT DE REVÊTEMENT
(JA) コーティング剤、および該コーティング剤を用いた電子部品モジュールの製造方法
Abstract
(EN)
Provided is a coating agent capable of: forming a coating layer having uniform heat insulating properties; and suppressing damage to an electronic component, said damage being caused by partial re-melting of solder or thermal expansion of a resin. A coating agent according to the present invention includes (A) a thermoplastic resin, (B) an organic solvent, (C) a thixotropic agent, and (D) hollow particles.
(FR)
L'invention concerne un agent de revêtement capable de : former une couche de revêtement ayant des propriétés d'isolation thermique uniformes ; et supprimer des dommages à un composant électronique, lesdits dommages étant provoqués par une refusion partielle de brasure ou d'expansion thermique d'une résine. Un agent de revêtement selon la présente invention comprend (A) une résine thermoplastique, (B) un solvant organique, (C) un agent thixotrope et (D) des particules creuses.
(JA)
均一な断熱性を有する被覆層を形成することができ、はんだの部分的な再溶融や樹脂の熱膨張によって電子部品が破損することを抑制できるコーティング剤を提供する。本発明のコーティング剤は、(A)熱可塑性樹脂、(B)有機溶剤、(C)チクソ剤、および(D)中空粒子を含む。
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