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1. WO2020116497 - METHOD FOR REMOVING PRESSURE-SENSITIVE ADHESIVE TAPE, PRESSURE-SENSITIVE ADHESIVE TAPE, AND ELECTRONIC COMPONENT

Publication Number WO/2020/116497
Publication Date 11.06.2020
International Application No. PCT/JP2019/047375
International Filing Date 04.12.2019
IPC
C09J 5/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
C09J 133/04 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
04Homopolymers or copolymers of esters
C09J 153/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
153Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
02Vinyl aromatic monomers and conjugated dienes
C09J 7/38 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
38Pressure-sensitive adhesives
C09J 7/50 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
50characterised by a primer layer between the carrier and the adhesive
Applicants
  • 積水化学工業株式会社 SEKISUI CHEMICAL CO., LTD. [JP]/[JP]
Inventors
  • 小谷野 春 KOYANO, Haru
  • 郭 嘉謨 GUO, Jiamo
  • 小宮山 諒 KOMIYAMA, Ryou
  • 石堂 泰志 ISHIDO, Yasushi
Agents
  • 特許業務法人 安富国際特許事務所 YASUTOMI & ASSOCIATES
Priority Data
2018-22719904.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FOR REMOVING PRESSURE-SENSITIVE ADHESIVE TAPE, PRESSURE-SENSITIVE ADHESIVE TAPE, AND ELECTRONIC COMPONENT
(FR) PROCÉDÉ DE RETRAIT D'UN RUBAN ADHÉSIF SENSIBLE À LA PRESSION, RUBAN ADHÉSIF SENSIBLE À LA PRESSION ET COMPOSANT ÉLECTRONIQUE
(JA) 粘着テープの剥離方法、粘着テープ及び電子部品
Abstract
(EN)
The purpose of the present invention is to provide: a method for removing a pressure-sensitive adhesive tape, the method making it possible that a component fixed with the pressure-sensitive adhesive tape is less apt to be damaged when recovered; a pressure-sensitive adhesive tape to be subjected to the removal method; and an electronic component including the pressure-sensitive adhesive tape to be subjected to the removal method. The method is for removing a pressure-sensitive adhesive tape which comprises a pressure-sensitive adhesive layer including a styrene-based elastomer and has been bonded to an adherend to form a multilayer structure, and comprises bringing a remover liquid having an SP value of 22.0 or less into contact with the pressure-sensitive adhesive layer of the multilayer structure and thereafter removing the pressure-sensitive adhesive tape from the adherend.
(FR)
L'objet de la présente invention est de fournir : un procédé de retrait d'un ruban adhésif sensible à la pression, le procédé permettant qu'un composant fixé avec le ruban adhésif sensible à la pression soit moins susceptible d'être endommagé lorsqu'il est récupéré ; un ruban adhésif sensible à la pression devant être soumis au procédé de retrait ; et un composant électronique comprenant le ruban adhésif sensible à la pression devant être soumis au procédé de retrait. Le procédé consiste à retirer un ruban adhésif sensible à la pression qui comprend une couche adhésive sensible à la pression comprenant un élastomère à base de styrène et qui a été lié à une partie adhérée pour former une structure multicouche et consiste à mettre en contact un liquide décapant ayant une valeur SP inférieure ou égale à 22,0 avec la couche adhésive sensible à la pression de la structure multicouche, puis à retirer le ruban adhésif sensible à la pression de la partie adhérée.
(JA)
本発明は、粘着テープによって固定された部品を回収する際に部品が損傷し難い粘着テープの剥離方法、該剥離方法に用いる粘着テープ及び該剥離方法に用いる粘着テープが用いられた電子部品を提供することを目的とする。 本発明は、スチレン系エラストマーを含有する粘着剤層を有する粘着テープと被着体とが貼り合された積層体の前記粘着剤層に、SP値22.0以下の剥離液を接触させた後、前記被着体と前記粘着テープとを剥離する、粘着テープの剥離方法である。
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