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1. WO2020116408 - RESIN COMPOSITION FOR MILLIMETER-WAVE SUBSTRATE, ADHESIVE FILM FOR MILLIMETER-WAVE SUBSTRATE, MILLIMETER-WAVE SUBSTRATE, MILLIMETER-WAVE RADAR SUBSTRATE, AND SEMICONDUCTOR DEVICE

Publication Number WO/2020/116408
Publication Date 11.06.2020
International Application No. PCT/JP2019/047101
International Filing Date 02.12.2019
IPC
C09J 11/06 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
06organic
H01L 23/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
C08K 5/5313 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
49Phosphorus-containing compounds
51Phosphorus bound to oxygen
53bound to oxygen and to carbon only
5313Phosphinic compounds, e.g. R2=P(:O)OR'
C08L 53/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
53Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
C09J 109/06 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
109Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
06Copolymers with styrene
C09J 153/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
153Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
02Vinyl aromatic monomers and conjugated dienes
CPC
C08K 5/5313
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
49Phosphorus-containing compounds
51Phosphorus bound to oxygen
53bound to oxygen and to carbon only
5313Phosphinic compounds, e.g. R2=P(:O)OR'
C08L 53/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
53Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
C09J 109/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
109Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
06Copolymers with styrene
C09J 11/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
02Non-macromolecular additives
06organic
C09J 153/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
153Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
02Vinyl aromatic monomers and conjugated dienes
C09J 163/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Applicants
  • ナミックス株式会社 NAMICS CORPORATION [JP]/[JP]
Inventors
  • 黒川 津与志 KUROKAWA Tsuyoshi
  • 吉田 真樹 YOSHIDA Masaki
  • 佐藤 淳也 SATO Junya
Agents
  • 渡會 祐介 WATARAI Yusuke
Priority Data
2018-22703004.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) RESIN COMPOSITION FOR MILLIMETER-WAVE SUBSTRATE, ADHESIVE FILM FOR MILLIMETER-WAVE SUBSTRATE, MILLIMETER-WAVE SUBSTRATE, MILLIMETER-WAVE RADAR SUBSTRATE, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DE RÉSINE POUR SUBSTRAT À ONDES MILLIMÉTRIQUES, FILM ADHÉSIF POUR SUBSTRAT À ONDES MILLIMÉTRIQUES, SUBSTRAT À ONDES MILLIMÉTRIQUES, SUBSTRAT RADAR À ONDES MILLIMÉTRIQUES ET DISPOSITIF À SEMI-CONDUCTEURS
(JA) ミリ波基板用樹脂組成物、ミリ波基板用接着フィルム、ミリ波基板、ミリ波レーダー基板および半導体装置
Abstract
(EN)
The present invention provides a resin composition that is for a millimeter-wave substrate, that provides a cured product having excellent high-frequency characteristics, a small temperature dependence of tanδ, and superior flame retardance, and that can be used as an insulator for a millimeter-wave radar. The resin composition for a millimeter-wave substrate contains a hydrogenated styrene-based elastomer (A), a cross-linkable compound (B) having a biphenyl backbone, and a flame retardant (C) containing a metal salt of phosphinic acid, and is characterized in that: component (C) accounts for 15-50 parts by mass with respect to a total of 100 parts by mass of component (A), component (B), and component (C); and the rate of change of dielectric tangent of a cured product of said resin composition at 10 GHz at 120°C is at most 30% with respect to that at 25°C.
(FR)
La présente invention concerne une composition de résine qui est destinée à un substrat à ondes millimétriques, qui fournit un produit durci présentant d'excellentes caractéristiques haute fréquence, une faible dépendance à la température de tanδ, et un caractère ignifugeant supérieur, et qui peut être utilisé comme isolant pour un radar à ondes millimétriques. La composition de résine pour substrat à ondes millimétriques contient un élastomère à base de styrène hydrogéné (A), un composé réticulable (B) ayant un squelette biphényle, et un agent ignifuge (C) contenant un sel métallique d'acide phosphinique, et est caractérisé en ce que : le composant (C) représente 15 à 50 parties en masse par rapport à un total de 100 parties en masse du constituant (A), du constituant (B) et du constituant (C) ; et le taux de variation de la tangente diélectrique d'un produit durci de ladite composition de résine à 10 GHz à 120 °C est d'au plus 30 % par rapport à celle à 25° C.
(JA)
樹脂組成物の硬化物が高周波特性に優れ、tanδの温度依存性が小さく、かつ難燃性に優れる、ミリ波レーダー用の絶縁体として使用することが可能なミリ波基板用樹脂組成物を提供することである。 (A)水添スチレン系エラストマーと、(B)ビフェニル骨格を有する架橋可能な化合物と、(C)ホスフィン酸金属塩を含む難燃剤と、を含む樹脂組成物であって、(C)成分が、(A)成分と(B)成分と(C)成分との合計100質量部に対して、15質量部~50質量部であり、硬化物の10GHzでの誘電正接の25℃での値に対する120℃での値の変化率が、30%以下であることを特徴とする、ミリ波基板用樹脂組成物である。
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