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1. WO2020116313 - REINFORCING RESIN COMPOSITION, ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MANUFACTURING METHOD, MOUNTING STRUCTURE, AND MOUNTING STRUCTURE MANUFACTURING METHOD

Publication Number WO/2020/116313
Publication Date 11.06.2020
International Application No. PCT/JP2019/046596
International Filing Date 28.11.2019
IPC
C08G 59/40 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
C08G 59/56 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
50Amines
56together with other curing agents
C08G 59/62 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
62Alcohols or phenols
H01L 23/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
Applicants
  • パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP]/[JP]
Inventors
  • 山津 繁 YAMATSU, Shigeru
  • 鈴木 康寛 SUZUKI, Yasuhiro
  • 日野 裕久 HINO, Hirohisa
Agents
  • 特許業務法人北斗特許事務所 HOKUTO PATENT ATTORNEYS OFFICE
Priority Data
2018-22675703.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) REINFORCING RESIN COMPOSITION, ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MANUFACTURING METHOD, MOUNTING STRUCTURE, AND MOUNTING STRUCTURE MANUFACTURING METHOD
(FR) COMPOSITION DE RÉSINE DE RENFORCEMENT, COMPOSANT ÉLECTRONIQUE, PROCÉDÉ DE FABRICATION DE COMPOSANT ÉLECTRONIQUE, STRUCTURE DE MONTAGE ET PROCÉDÉ DE FABRICATION DE STRUCTURE DE MONTAGE
(JA) 補強用樹脂組成物、電子部品、電子部品の製造方法、実装構造体及び実装構造体の製造方法
Abstract
(EN)
This reinforcing thermosetting resin composition contains: an epoxy resin (A); a phenol resin (B); and a benzoxazine compound (C).
(FR)
Cette composition de résine thermodurcissable de renforcement contient : (a), une résine epoxy (A) ; une résine phénolique (B) ; et un composé de benzoxazine (C).
(JA)
補強用熱硬化性樹脂組成物は、エポキシ樹脂(A)、フェノール樹脂(B)、及びベンゾオサジン化合物(C)を含む。
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