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1. WO2020116306 - HIGH VOLTAGE CIRCUIT BOARD AND HIGH VOLTAGE DEVICE USING SAME

Publication Number WO/2020/116306
Publication Date 11.06.2020
International Application No. PCT/JP2019/046537
International Filing Date 28.11.2019
IPC
H01L 23/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H01L 23/14 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
H01L 23/36 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
H05K 3/46 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
CPC
H01L 23/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H01L 23/14
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
H01L 23/36
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
H05K 1/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/03
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
H05K 3/46
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
Applicants
  • 株式会社クラレ KURARAY CO., LTD. [JP]/[JP]
Inventors
  • 砂本 辰也 SUNAMOTO, Tatsuya
  • 小野寺 稔 ONODERA, Minoru
Agents
  • 杉本 修司 SUGIMOTO, Shuji
  • 野田 雅士 NODA, Masashi
  • 堤 健郎 TSUTSUMI, Takeo
  • 小林 由佳 KOBAYASHI, Yuka
  • 中田 健一 NAKADA, Kenichi
  • 中尾 真二 NAKAO, Shinji
Priority Data
2018-22717104.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) HIGH VOLTAGE CIRCUIT BOARD AND HIGH VOLTAGE DEVICE USING SAME
(FR) CARTE DE CIRCUIT IMPRIMÉ HAUTE TENSION ET DISPOSITIF HAUTE TENSION L'UTILISANT
(JA) 高電圧用回路基板およびそれを用いた高電圧デバイス
Abstract
(EN)
Provided are: a circuit board comprising an insulation layer formed of a thermoplastic liquid crystal polymer and having excellent insulation reliability under a high voltage; and a high voltage device using the same. The circuit board (30) is a high voltage circuit board comprising an insulation layer (31) and a circuit layer (34) for high voltage, wherein the insulation layer (31) is formed of a thermoplastic liquid crystal polymer. It is preferable that the circuit board (30) comprises a heat dissipation member (39) for dissipating heat from the insulation layer (31).
(FR)
L'invention concerne : une carte de circuit imprimé comprenant une couche d'isolation formée d'un polymère à cristaux liquides thermoplastique et ayant une excellente fiabilité d'isolation sous une haute tension ; et un dispositif à haute tension l'utilisant. La carte de circuit imprimé (30) est une carte de circuit imprimé haute tension comprenant une couche d'isolation (31) et une couche de circuit (34) pour une haute tension, la couche d'isolation (31) étant formée d'un polymère à cristaux liquides thermoplastique. Il est préférable que la carte de circuit imprimé (30) comprenne un élément de dissipation de chaleur (39) pour dissiper la chaleur provenant de la couche d'isolation (31).
(JA)
熱可塑性液晶ポリマーで絶縁層が構成され、高電圧下での絶縁信頼性に優れている回路基板およびこれを用いた高電圧デバイスを提供する。前記回路基板(30)は、絶縁層(31)と、高電圧用の回路層(34)とを備える回路基板であって、前記絶縁層(31)が、熱可塑性液晶ポリマーで構成される高電圧用回路基板である。前記回路基板(30)は、絶縁層(31)からの熱を放熱するための放熱部材(39)を備えているのが好ましい。
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