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1. WO2020116300 - COMPOSITION AND MEMBRANE MANUFACTURING METHOD

Publication Number WO/2020/116300
Publication Date 11.06.2020
International Application No. PCT/JP2019/046523
International Filing Date 28.11.2019
IPC
C01B 33/145 2006.01
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF
33Silicon; Compounds thereof
113Silicon oxides; Hydrates thereof
12Silica; Hydrates thereof, e.g. lepidoic silicic acid
14Colloidal silica, e.g. dispersions, gels, sols
145Preparation of hydroorganosols, organosols or dispersions in an organic medium
C09D 201/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
201Coating compositions based on unspecified macromolecular compounds
C08F 2/44 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
2Processes of polymerisation
44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
C09D 7/20 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/88; Processes for incorporating ingredients in coating compositions
20Diluents or solvents
C09D 7/61 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/88; Processes for incorporating ingredients in coating compositions
40Additives
60non-macromolecular
61inorganic
Applicants
  • 富士フイルム株式会社 FUJIFILM CORPORATION [JP]/[JP]
Inventors
  • 大河原 昂広 OKAWARA Takahiro
Agents
  • 特許業務法人特許事務所サイクス SIKs & Co.
Priority Data
2018-22807005.12.2018JP
2019-04111307.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) COMPOSITION AND MEMBRANE MANUFACTURING METHOD
(FR) COMPOSITION ET PROCÉDÉ DE FABRICATION DE MEMBRANE
(JA) 組成物および膜の製造方法
Abstract
(EN)
This composition contains colloidal silica particles and a solvent, and has a viscosity of not more than 4 mPa·s at 25°C, wherein the colloidal silica particles are each obtained by linking a plurality of spherical silica particles in a rosary-like manner or by linking a plurality of spherical silica in a planar manner. The solvent contains a solvent A1 having a boiling point of 190-280°C. This membrane manufacturing method uses said composition.
(FR)
La composition selon la présente invention contient des particules de silice colloïdale et un solvant, et a une viscosité ne dépassant pas 4 mPa·s à 25 °C, les particules de silice colloïdale étant chacune obtenues par liaison en chapelet d'une pluralité de particules sphériques de silice ou par liaison plane d'une pluralité de particules sphériques de silice. Le solvant contient un solvant A1 ayant un point d'ébullition de 190 à 280 °C. Le procédé de fabrication de membrane selon la présente invention utilise ladite composition.
(JA)
コロイダルシリカ粒子と溶剤とを含み、25℃での粘度が4mPa・s以下である。上記コロイダルシリカ粒子は、複数個の球状シリカ粒子が数珠状に連結されているものであるか、あるいは、複数個の球状シリカが平面的に連結されている組成物。上記溶剤は、沸点が190℃以上280℃以下の溶剤A1を含む。前述の組成物を用いる膜の製造方法。
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