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1. WO2020116215 - METHOD FOR FORMING COATING FILM

Publication Number WO/2020/116215
Publication Date 11.06.2020
International Application No. PCT/JP2019/045886
International Filing Date 22.11.2019
IPC
B05D 1/36 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
1Processes for applying liquids or other fluent materials
36Successively applying liquids or other fluent materials, e.g. without intermediate treatment
B05D 3/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
3Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
C09D 201/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
201Coating compositions based on unspecified macromolecular compounds
C09D 7/20 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/88; Processes for incorporating ingredients in coating compositions
20Diluents or solvents
CPC
B05D 1/36
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
1Processes for applying liquids or other fluent materials
36Successively applying liquids or other fluent materials, e.g. without intermediate treatment
B05D 3/00
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
3Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
C09D 201/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
201Coating compositions based on unspecified macromolecular compounds
C09D 7/20
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/00
20Diluents or solvents
Applicants
  • 花王株式会社 KAO CORPORATION [JP]/[JP]
Inventors
  • 福田 輝幸 FUKUDA, Teruyuki
Agents
  • 特許業務法人大谷特許事務所 OHTANI PATENT OFFICE
Priority Data
2018-23017107.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FOR FORMING COATING FILM
(FR) PROCÉDÉ DE FORMATION DE FILM DE REVÊTEMENT
(JA) 塗膜の形成方法
Abstract
(EN)
The present invention relates to a method for forming a coating film, which comprises: a step 1 wherein a liquid composition I that contains a solvent A, a solvent B and a polymer C is applied to a base material; and a step 2 wherein droplets of a liquid II that contains water are applied to the liquid composition I that has been applied onto the base material in the step 1. This method for forming a coating film is configured such that: the solvent A has a boiling point of less than 99°C; the distance Ra of the Hansen solubility parameter of the solvent A with respect to water is 36 or less; the solvent B has a boiling point of 150°C or more; the distance Ra of the Hansen solubility parameter of the solvent B with respect to water is 40 or more; the solvent B and the solvent A are compatible with each other; the polymer C is soluble in the solvent A, but is not soluble in the solvent B; and the average diameter d of the droplets applied in the step 2 is from 0.01 μm to 50 μm (inclusive).
(FR)
L'invention concerne un procédé de formation de film de revêtement qui inclut : une étape (1) au cours de laquelle une composition liquide (I) comprenant un solvant (A), un solvant (B) et un polymère (C) est additionnée à un substrat ; et une étape (2) au cours de laquelle des gouttes d'un liquide (II) comprenant une eau est additionnée à la composition liquide (I) sur le substrat après addition à l'étape (1). Le point d'ébullition du solvant (A) est inférieur à 99°C. L'écart du paramètre de solubilité de Hansen (Ra) du solvant (A) vis-à-vis de l'eau est inférieur ou égal à 36. Le point d'ébullition du solvant (B) est supérieur ou égal à 150°C. L'écart du paramètre de solubilité de Hansen (Ra) du solvant (B) vis-à-vis de l'eau est supérieur ou égal à 40. Le solvant (B) est compatible avec le solvant (A). Le polymère (C) est soluble dans le solvant (A), mais n'est pas soluble dans le solvant (B). Le diamètre moyen (d) des gouttes additionnées lors de l'étape (2) est supérieur ou égal à 0,01μm et inférieur ou égal à 50μm.
(JA)
溶媒A、溶媒B、及びポリマーCを含有する液体組成物Iを基材に付与する工程1と、工程1で付与された基材上の液体組成物Iに、水を含有する液体IIの液滴を付与する工程2とを含み、該溶媒Aの沸点が99℃未満であり、該溶媒Aの水に対するハンセン溶解度パラメータの距離Raが36以下であり、該溶媒Bの沸点が150℃以上であり、該溶媒Bの水に対するハンセン溶解度パラメータの距離Raが40以上であり、該溶媒Bが該溶媒Aと相溶し、かつ該ポリマーCが該溶媒Aに可溶で該溶媒Bに不溶であり、工程2で付与される液滴の平均直径dが0.01μm以上50μm以下である、塗膜の形成方法に関する。
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