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1. WO2020116199 - CONDENSATION-CURABLE RESIN COMPOSITION, CURED PRODUCT, MOLDED BODY, AND SEMICONDUCTOR DEVICE

Publication Number WO/2020/116199
Publication Date 11.06.2020
International Application No. PCT/JP2019/045755
International Filing Date 22.11.2019
IPC
C08L 83/06 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
06containing silicon bound to oxygen-containing groups
C08K 5/5415 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
54Silicon-containing compounds
541containing oxygen
5415containing at least one Si-O bond
H01L 23/29 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H01L 23/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
H01L 33/56 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
56Materials, e.g. epoxy or silicone resin
CPC
C08G 77/16
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
77Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
04Polysiloxanes
14containing silicon bound to oxygen-containing groups
16to hydroxyl groups
C08K 5/5415
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
54Silicon-containing compounds
541containing oxygen
5415containing at least one Si—O bond
C08L 83/06
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
06containing silicon bound to oxygen-containing groups
H01L 23/29
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
H01L 23/31
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
H01L 33/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
56Materials, e.g. epoxy or silicone resin
Applicants
  • JNC株式会社 JNC CORPORATION [JP]/[JP]
Inventors
  • 池野 浩章 IKENO Hironori
  • 諏訪 和也 SUWA Kazuya
  • 西澤 啓介 NISHIZAWA Keisuke
  • 木谷 綾花 KIYA Ayaka
  • 川畑 毅一 KAWABATA Kiichi
Priority Data
2018-22710104.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CONDENSATION-CURABLE RESIN COMPOSITION, CURED PRODUCT, MOLDED BODY, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DE RÉSINE DURCISSABLE PAR CONDENSATION, PRODUIT DURCI, CORPS MOULÉ ET DISPOSITIF SEMI-CONDUCTEUR
(JA) 縮合硬化型樹脂組成物、硬化物、成形体、及び半導体装置
Abstract
(EN)
Provided are: a condensation-curable resin composition and a cured product from which a molded body in which embrittlement and coloring hardly occur even when exposed to a high temperature for a long period of time can be obtained; and a molded body and a semiconductor device using the same. The present invention relates to a condensation-curable resin composition comprising: (A) an organosilicon compound; and (B) an organometallic compound having 3 or more condensable groups, wherein the (A) organosilicon compound contains a structural unit (i) represented by formula (i) and a structural unit (ii) represented by formula (ii), has SiOH groups at respective both ends of a molecular chain, and has a weight average molecular weight of 10,000-10,000,000. In formula (i), R1's are each independently a hydrocarbon group having 1 to 8 carbon atoms. In formula (ii), R2's are each independently a hydrocarbon group having 1 to 8 carbon atoms.
(FR)
L'invention concerne une composition de résine durcissable par condensation et un produit durci à partir duquel peut être obtenu un corps moulé dans lequel la fragilisation et la coloration se produisent rarement même lorsqu'ils sont exposés à une température élevée pendant une longue période de temps. L'invention concerne également un corps moulé et un dispositif à semi-conducteur l'utilisant. La présente invention concerne une composition de résine durcissable par condensation comprenant : un composé d'organosilicium (A) ; et un composé organométallique (B) ayant 3 groupes condensables ou plus, le composé d'organosilicium (A) contenant une unité structurale (i) représentée par la formule (i) et une unité structurale (ii) représentée par la formule (ii), ayant des groupes SiOH au niveau des deux extrémités respectives d'une chaîne moléculaire, et ayant un poids moléculaire moyen en poids de 10 000 à 10 000 000. Dans la formule (i), chacun des R1 est indépendamment un groupe hydrocarboné ayant 1 à 8 atomes de carbone. Dans la formule (ii), chacun des R2 est indépendamment un groupe hydrocarboné ayant 1 à 8 atomes de carbone.
(JA)
長期間高温に曝されても脆化及び着色が生じ難い成形体を得ることができる縮合硬化型樹脂組成物及び状硬化物、並びにこれらを用いた成形体及び半導体装置を提供する。 本発明は、(A)下記式(i)で表される構造単位(i)及び下記式(ii)で表される構造単位(ii)を含み、分子鎖の両末端にそれぞれSiOH基が存在し、重量平均分子量が10,000以上10,000,000以下である有機ケイ素化合物、並びに(B)3以上の縮合反応性基を有する有機金属化合物を含有する縮合硬化型樹脂組成物である。式(i)中、Rは、それぞれ独立して、炭素数1~8の炭化水素基である。式(ii)中、Rは、それぞれ独立して、炭素数1~8の炭化水素基である。
Also published as
Latest bibliographic data on file with the International Bureau