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1. WO2020116088 - SEMICONDUCTOR DEVICE AND IMAGING DEVICE

Publication Number WO/2020/116088
Publication Date 11.06.2020
International Application No. PCT/JP2019/043904
International Filing Date 08.11.2019
IPC
H01L 27/146 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
H04N 5/335 2011.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
30Transforming light or analogous information into electric information
335using solid-state image sensors
H04N 5/357 2011.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
30Transforming light or analogous information into electric information
335using solid-state image sensors
357Noise processing, e.g. detecting, correcting, reducing or removing noise
Applicants
  • ソニーセミコンダクタソリューションズ株式会社 SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP]/[JP]
Inventors
  • 矢守 俊介 YAMORI Shunsuke
  • 高森 麗 TAKAMORI Rei
Agents
  • 松尾 憲一郎 MATSUO Kenichiro
Priority Data
2018-22647503.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SEMICONDUCTOR DEVICE AND IMAGING DEVICE
(FR) DISPOSITIF À SEMI-CONDUCTEUR ET DISPOSITIF D'IMAGERIE
(JA) 半導体装置および撮像装置
Abstract
(EN)
The present invention reduces noise generated in a semiconductor device. This semiconductor device comprises a semiconductor chip and a conductor. Herein, the semiconductor chip included in the semiconductor device is provided with a light-receiving surface for generating an image signal, and outputs the image signal generated on the light-receiving surface. Moreover, the conductor included in the semiconductor device is disposed, in the semiconductor device, in a section other than the light-receiving surface which is of the semiconductor chip and which is for generating the image signal.
(FR)
La présente invention réduit le bruit généré dans un dispositif à semi-conducteur. Ce dispositif semi-conducteur comprend une puce semi-conductrice et un conducteur. La puce semi-conductrice incluse dans le dispositif à semi-conducteur comporte une surface de réception de lumière pour générer un signal d'image, et délivre le signal d'image généré sur la surface de réception de lumière. De plus, le conducteur inclus dans le dispositif à semi-conducteur est disposé, dans le dispositif à semi-conducteur, dans une section autre que la surface de réception de lumière qui est de la puce semi-conductrice et qui est destinée à générer le signal d'image.
(JA)
半導体装置において発生するノイズを低減させる。 半導体装置は、半導体チップと、導電体とを備える半導体装置である。ここで、半導体装置が備える半導体チップは、画像信号を生成するための受光面を備え、受光面において生成された画像信号を出力する半導体チップである。また、半導体装置が備える導電体は、半導体装置において、画像信号を生成するための受光面を備える半導体チップの受光面以外の部分に配置される導電体である。
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