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1. WO2020116057 - CURED PRODUCT OF THERMALLY CONDUCTIVE SILICONE COMPOSITION

Publication Number WO/2020/116057
Publication Date 11.06.2020
International Application No. PCT/JP2019/042685
International Filing Date 30.10.2019
IPC
C08L 83/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
C08L 83/06 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
06containing silicon bound to oxygen-containing groups
C08L 83/07 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
07containing silicon bound to unsaturated aliphatic groups
C08K 3/22 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
22of metals
C08K 3/28 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
28Nitrogen-containing compounds
Applicants
  • 信越化学工業株式会社 SHIN-ETSU CHEMICAL CO., LTD. [JP]/[JP]
Inventors
  • 石原 靖久 ISHIHARA Yasuhisa
  • 遠藤 晃洋 ENDO Akihiro
  • 田中 克幸 TANAKA Katsuyuki
Agents
  • 好宮 幹夫 YOSHIMIYA Mikio
  • 小林 俊弘 KOBAYASHI Toshihiro
Priority Data
2018-22748404.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURED PRODUCT OF THERMALLY CONDUCTIVE SILICONE COMPOSITION
(FR) PRODUIT DURCI DE COMPOSITION DE SILICONE THERMOCONDUCTRICE
(JA) 熱伝導性シリコーン組成物の硬化物
Abstract
(EN)
The present invention is a cured product of a thermally conductive silicone composition, which is characterized by containing 6-40% by volume of an organopolysiloxane as a component (A), while containing 60-94% by volume of a thermally conductive filler as a component (B), and which is also characterized in that: the thermally conductive filler is composed of (B-i) a non-sintered ground aluminum nitride which has an average particle diameter of 40 μm or more, while containing 1% by mass or less of fine particles that have a particle diameter of 5 μm or less, and (B-ii) a thermally conductive substance which is other than the non-sintered ground aluminum nitride and has an average particle diameter of 1 μm or more; and the component (B-ii) is contained in an amount of 30-65% by volume. Consequently, the present invention provides a cured product of a thermally conductive silicone composition, which has high thermal conductivity, while having excellent handling properties.
(FR)
La présente invention concerne un produit durci d'une composition de silicone thermoconductrice, qui est caractérisé en ce qu'il contient de 6 à 40 % en volume d'un organopolysiloxane en tant que composant (A), tout en contenant 60 à 94 % en volume d'une charge thermiquement conductrice en tant que composant (B), et qui est également caractérisé en ce que : la charge thermoconductrice est composée de (B-i) un nitrure d'aluminium broyé non fritté qui a un diamètre moyen de particule de 40 µm ou plus, tout en contenant 1 % en masse ou moins de particules fines qui ont un diamètre de particule de 5 µm ou moins, et (B-ii) une substance thermiquement conductrice qui est autre que le nitrure d'aluminium broyé non fritté et a un diamètre moyen de particule de 1 µm ou plus ; et le composant (B-ii) est contenu en une quantité de 30 à 65 % en volume. Par conséquent, la présente invention concerne un produit durci d'une composition de silicone thermoconductrice, qui a une conductivité thermique élevée, tout en ayant d'excellentes propriétés de manipulation.
(JA)
本発明は、(A)成分としてオルガノポリシロキサンを6~40体積%、(B)成分として熱伝導性充填材を60~94体積%の比率で含有し、前記熱伝導性充填材は、(B-i)平均粒径40μm以上、かつ粒径5μm以下の微粉が1質量%以下である非焼結の破砕状窒化アルミニウムと、(B-ii)該非焼結の破砕状窒化アルミニウム以外であって平均粒径1μm以上である熱伝導性物質とからなり、前記(B-ii)が30~65体積%であることを特徴とする熱伝導性シリコーン組成物の硬化物である。これにより、取り扱い性に優れ、高い熱伝導性を有する熱伝導性シリコーン組成物の硬化物を提供する。
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