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1. WO2020115680 - COMPOSITION FOR FORMING A PATTERNED METAL FILM ON A SUBSTRATE

Publication Number WO/2020/115680
Publication Date 11.06.2020
International Application No. PCT/IB2019/060441
International Filing Date 04.12.2019
IPC
C09D 11/52 2014.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
11Inks
52Electrically conductive inks
C23C 18/31 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
31Coating with metals
C23C 18/14 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
14Decomposition by irradiation, e.g. photolysis, particle radiation
C30B 7/06 2006.01
CCHEMISTRY; METALLURGY
30CRYSTAL GROWTH
BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
7Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions
02by evaporation of the solvent
06using non-aqueous solvents
Applicants
  • ORELTECH LTD. [IL]/[IL]
Inventors
  • ZAMOSHCHIK, Natalia
  • LIVANOV, Konstantin
Priority Data
62/776,62707.12.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) COMPOSITION FOR FORMING A PATTERNED METAL FILM ON A SUBSTRATE
(FR) COUCHES MÉTALLIQUES CONDUCTRICES TRANSPARENTES
Abstract
(EN)
A method for growing a transparent conductive metal layer on a substrate is disclosed. The method includes the steps of applying crystal growth ink to a surface of the substrate, wherein the crystal growth ink includes a metal ionic precursor; and exposing the substrate to plasma irradiation to cause the growing of a crystalline metal framework on the substrate, wherein the exposure is based on a set of predefined exposure parameters.
(FR)
L'invention concerne un procédé pour faire croître une couche métallique conductrice transparente sur un substrat. Le procédé comprend les étapes consistant à appliquer une encre de croissance cristalline sur une surface du substrat, l'encre de croissance cristalline comprenant un précurseur ionique métallique, et à exposer le substrat à un rayonnement de plasma du plasma pour provoquer la croissance d'une ossature métallique cristalline sur le substrat, l'exposition étant basée sur un ensemble de paramètres d'exposition prédéfinis.
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