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1. WO2020115559 - CURABLE HEAT-SEAL ADHESIVES FOR BONDING POLYMERS

Publication Number WO/2020/115559
Publication Date 11.06.2020
International Application No. PCT/IB2019/001357
International Filing Date 02.12.2019
IPC
C08F 290/06 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
02on to polymers modified by introduction of unsaturated end groups
06Polymers provided for in subclass C08G52
C08G 18/42 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
18Polymeric products of isocyanates or isothiocyanates
06with compounds having active hydrogen
28characterised by the compounds used containing active hydrogen
40High-molecular-weight compounds
42Polycondensates having carboxylic or carbonic ester groups in the main chain
C09J 175/16 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
175Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
04Polyurethanes
14Polyurethanes having carbon-to-carbon unsaturated bonds
16having terminal carbon-to-carbon unsaturated bonds
CPC
C08F 290/067
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
02on to polymers modified by introduction of unsaturated end groups
06Polymers provided for in subclass C08G
067Polyurethanes; Polyureas
C08G 18/4238
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
18Polymeric products of isocyanates or isothiocyanates
06with compounds having active hydrogen
28characterised by the compounds used containing active hydrogen
40High-molecular-weight compounds
42Polycondensates having carboxylic or carbonic ester groups in the main chain
4236containing only aliphatic groups
4238derived from dicarboxylic acids and dialcohols
C08G 18/672
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
18Polymeric products of isocyanates or isothiocyanates
06with compounds having active hydrogen
28characterised by the compounds used containing active hydrogen
67Unsaturated compounds having active hydrogen
671Unsaturated compounds having only one group containing active hydrogen
672Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
C09J 175/16
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
175Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
04Polyurethanes
14Polyurethanes having carbon-to-carbon unsaturated bonds
16having terminal carbon-to-carbon unsaturated bonds
Applicants
  • ARKEMA FRANCE [FR]/[FR]
Inventors
  • BAILEY, Michael, A.
  • KLANG, Jeffrey
Agents
  • ROGEAU, Antoine
Priority Data
62/774,40503.12.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) CURABLE HEAT-SEAL ADHESIVES FOR BONDING POLYMERS
(FR) ADHÉSIFS THERMOADHÉSIFS DURCISSABLES POUR LA LIAISON DE POLYMÈRES
Abstract
(EN)
Curable compositions include a urethane (meth)acrylate oligomer having a number- average molecular weight of at least 6000 g/mol; at least one mono(meth)acrylate monomer; a multifunctional crosslinking monomer chosen from acrylate monomers, methacrylate monomers, or combinations thereof; and an ethylene–vinyl acetate grafted terpolymer. The mono(meth)acrylate monomers may include a first mono(meth)acrylate with Tg between 50 °C and 175 °C and a second mono(meth)acrylate with Tg between −50 °C and 30 °C. The curable compositions may be applied onto a surface of a substrate then cured to form a low-tack adhesive layer on the surface. The curable compositions may be cured by exposure to visible radiation, UV radiation, LED radiation, laser radiation, electron-beam radiation, peroxide, accelerator, or heat. Methods for bonding substrates include contacting a second substrate to a low-tack adhesive layer on a first substrate, then heating the low-tack adhesive layer to bond the substrates and form a laminate.
(FR)
Des compositions durcissables comprennent un oligomère d'uréthane (méth)acrylate ayant un poids moléculaire moyen en nombre d'au moins 6 000 g/mol ; au moins un monomère de mono (méth)acrylate ; un monomère de réticulation multifonctionnel choisi parmi les monomères d'acrylate, les monomères de méthacrylate ou des combinaisons associées ; et un terpolymère greffé d'éthylène-acétate de vinyle. Les monomères de mono (méth)acrylate peuvent comprendre un premier mono (méth)acrylate ayant une Tg comprise entre 50 °C et 175 °C et un second mono (méth)acrylate présentant une Tg comprise entre -50 °C et 30 °C. Les compositions durcissables peuvent être appliquées sur une surface d'un substrat puis durcies de sorte à former une couche adhésive à faible pégosité sur la surface. Les compositions durcissables peuvent être durcies par exposition à un rayonnement visible, un rayonnement UV, un rayonnement de DEL, un rayonnement laser, un rayonnement de faisceau d'électrons, un peroxyde, un accélérateur ou de la chaleur. Des procédés de liaison de substrats comprennent la mise en contact d'un second substrat avec une couche adhésive à faible pégosité sur un premier substrat, puis le chauffage de la couche adhésive à faible pégosité afin de lier les substrats et de former un stratifié.
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