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1. WO2020115289 - ACTIVATING SURFACES FOR SUBSEQUENT BONDING

Publication Number WO/2020/115289
Publication Date 11.06.2020
International Application No. PCT/EP2019/084009
International Filing Date 06.12.2019
IPC
C08J 5/12 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
12Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
C08J 7/12 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
7Chemical treatment or coating of shaped articles made of macromolecular substances
12Chemical modification
C09J 5/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
02involving pretreatment of the surfaces to be joined
B29C 65/48 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65Joining of preformed parts; Apparatus therefor
48using adhesives
CPC
B29C 65/48
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65Joining ; or sealing; of preformed parts ; , e.g. welding of plastics materials; Apparatus therefor
48using adhesives ; , i.e. using supplementary joining material; solvent bonding
C08J 5/12
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
5Manufacture of articles or shaped materials containing macromolecular substances
12Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
C08J 7/123
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
7Chemical treatment or coating of shaped articles made of macromolecular substances
12Chemical modification
123Treatment by wave energy or particle radiation
C09J 2205/31
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2205Other features
30of adhesive processes in general
31Use of irradiation
C09J 2400/228
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2400Presence of inorganic and organic materials
20Presence of organic materials
22Presence of unspecified polymer
228in the pretreated surface to be joined
C09J 2467/008
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2467Presence of polyester
008in the pretreated surface to be joined
Applicants
  • HENKEL IP & HOLDING GMBH [DE]/[DE]
Inventors
  • DEEGAN, Brian
  • HABERLIN, Gavin
  • KNEAFSEY, Brendan
  • FEARON, Stephen
Agents
  • TOMKINS & CO
Priority Data
1819903.406.12.2018GB
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ACTIVATING SURFACES FOR SUBSEQUENT BONDING
(FR) SURFACES D’ACTIVATION POUR LIAISON ULTÉRIEURE
Abstract
(EN)
A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2. Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.
(FR)
L'invention concerne un procédé d'activation d'une surface d'un substrat en plastique formé à partir : (a) d’une polyaryléthercétone telle qu’une polyéther éther cétone (PEEK) ; d’une polyéther cétone cétone (PEKK), d’une polyéther cétone (PEK) ; d’une polyéther éther cétone cétone (PEEKK) ; ou d’une polyéther cétone éther cétone cétone (PEKEKK) ; (b) d’un polymère contenant un groupe phényle directement fixé à un groupe carbonyle, par exemple de polybutadiène térephtalate (PBT) éventuellement, le groupe carbonyle faisant partie d’un groupe amide, tel qu’un polyarylamide (PARA) ; (c) de poly(sulfure de phénylène) (PPS) ; ou (d) de polyétherimide (PEI) ; pour la liaison ultérieure, le procédé comprenant l’étape d’exposition de la surface au rayonnement actinique, le rayonnement actinique : comprenant un rayonnement ayant une longueur d’onde située dans la plage d’environ 10 nm à environ 1000 nm ; l’énergie du rayonnement actinique auquel la surface est exposée se situant dans la plage d’environ 0,5 J/cm2 à environ 300 J/cm2. Les substrats difficiles à lier sont ensuite plus facilement liés ultérieurement par exemple en utilisant un adhésif acrylique, époxy ou anaérobie.
Latest bibliographic data on file with the International Bureau