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1. WO2020115250 - ELECTRONIC MODULE

Publication Number WO/2020/115250
Publication Date 11.06.2020
International Application No. PCT/EP2019/083901
International Filing Date 05.12.2019
IPC
H01L 23/495 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
495Lead-frames
H02M 7/00 2006.01
HELECTRICITY
02GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
7Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
CPC
H01L 23/49555
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
495Lead-frames ; or other flat leads
49541Geometry of the lead-frame
49548Cross section geometry
49551characterised by bent parts
49555the bent parts being the outer leads
H01L 23/49558
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
495Lead-frames ; or other flat leads
49541Geometry of the lead-frame
49558Insulating layers on lead frames, e.g. bridging members
H01L 23/49562
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
495Lead-frames ; or other flat leads
49541Geometry of the lead-frame
49562for devices being provided for in H01L29/00
H01L 23/49575
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
495Lead-frames ; or other flat leads
49575Assemblies of semiconductor devices on lead frames
H02M 7/003
HELECTRICITY
02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
7Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
003Constructional details, e.g. physical layout, assembly, wiring, busbar connections
Applicants
  • VALEO EQUIPEMENTS ELECTRIQUES MOTEUR [FR]/[FR]
Inventors
  • TREGUER, Matthieu
Agents
  • GARCIA, Christine
Priority Data
FR187239105.12.2018FR
Publication Language French (FR)
Filing Language French (FR)
Designated States
Title
(EN) ELECTRONIC MODULE
(FR) MODULE ELECTRONIQUE
Abstract
(EN)
The invention relates to an electronic module 1 comprising: - an electronic component 19, - at least two traces 5, 6 for transmitting a power or control signal to the component, - a first housing 7 overmolded on the electronic component 1 and on the two traces 5, 6 and a second housing 8 for mechanically retaining the two traces 5, 6 arranged at a distance from the first housing 7.
(FR)
L'invention concerne un module électronique 1 comprenant : - un composant électronique 19, - au moins deux traces 5, 6 pour transmettre un signal de puissance ou de commande au composant, - un premier boitier surmoulé 7 sur le composant électronique 1 et sur les deux traces 5, 6, et un deuxième boîtier 8 de maintien mécanique des deux traces 5, 6, disposé à distance du premier boîtier 7.
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