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1. WO2020114829 - ADAPTIVE ALIGNMENT

Publication Number WO/2020/114829
Publication Date 11.06.2020
International Application No. PCT/EP2019/082502
International Filing Date 26.11.2019
IPC
G03F 7/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
G03F 9/00 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
9Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
CPC
G03F 7/70633
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
70633Overlay
G03F 9/7069
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
9Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
70for microlithography
7069Alignment mark illumination, e.g. darkfield, dual focus
G03F 9/7088
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
9Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
70for microlithography
7088Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
Applicants
  • ASML HOLDING N.V. [NL]/[NL]
Inventors
  • ANDERSSON, Greger, Göte
  • AARTS, Igor, Matheus, Petronella
  • DASTOURI, Zahrasadat
  • SHOME, Krishanu
Agents
  • SLENDERS, Petrus Johannes Waltherus
Priority Data
62/775,78005.12.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ADAPTIVE ALIGNMENT
(FR) ALIGNEMENT ADAPTATIF
Abstract
(EN)
A method of applying a measurement correction includes determining an orthogonal subspace used to characterize a first principal component of the measurement and a second principal component of the measurement, and rotating the orthogonal subspace by a first angle such that the first principle component rotates to become a first factor vector and the second principle component rotates to become a second factor vector. An asymmetry vector is generated by rotating the second factor vector by a second angle, where the asymmetry vector and the first factor vector define a non-orthogonal subspace. An asymmetry contribution is determined in the measurement based on the projection of the measurement onto the first factor vector in the non- orthogonal subspace. The method also includes subtracting the asymmetry contribution from the measurement.
(FR)
La présente invention concerne un procédé d'application d'une correction de mesure qui comprend la détermination d'un sous-espace orthogonal utilisé pour caractériser une première composante principale de la mesure et une seconde composante principale de la mesure, et la rotation du sous-espace orthogonal par un premier angle de telle sorte que la première composante principale tourne de façon à devenir un premier vecteur de facteur et que la seconde composante principale tourne de façon à devenir un second vecteur de facteur. Un vecteur d'asymétrie est généré grâce à la rotation du second vecteur de facteur par un second angle, le vecteur d'asymétrie et le premier vecteur de facteur définissant un sous-espace non orthogonal. Une contribution d'asymétrie est déterminée dans la mesure sur la base de la projection de la mesure sur le premier vecteur de facteur dans le sous-espace non orthogonal. Le procédé consiste également à soustraire la contribution d'asymétrie de la mesure.
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