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1. WO2020114787 - PACKAGING UNIT FOR SUBSTRATES

Publication Number WO/2020/114787
Publication Date 11.06.2020
International Application No. PCT/EP2019/082016
International Filing Date 21.11.2019
IPC
H01L 21/673 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
673using specially adapted carriers
B65D 85/30 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
85Containers, packaging elements or packages, specially adapted for particular articles or materials
30for articles particularly sensitive to damage by shock or pressure
CPC
H01L 21/67346
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
673using specially adapted carriers ; or holders; Fixing the workpieces on such carriers or holders
67346characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
H01L 21/67363
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
673using specially adapted carriers ; or holders; Fixing the workpieces on such carriers or holders
6735Closed carriers
67363specially adapted for containing substrates other than wafers
Applicants
  • HERAEUS DEUTSCHLAND GMBH & CO. KG [DE]/[DE]
Inventors
  • RICHTER, Hans-Jürgen
  • WACKER, Richard
  • PELSHAW, Nadja
  • LÖWER, Yvonne
Agents
  • MAIWALD PATENTANWALTS- UND RECHTSANWALTSGESELLSCHAFT MBH
Priority Data
18210737.506.12.2018EP
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERPACKUNGSEINHEIT FÜR SUBSTRATE
(EN) PACKAGING UNIT FOR SUBSTRATES
(FR) UNITÉ D'EMBALLAGE DESTINÉS À DES SUBSTRATS
Abstract
(DE)
Die vorliegende Erfindung betrifft eine Verpackungseinheit für Substrate, einen Verpackungsstapel mit solchen Verpackungseinheiten und ein Verfahren zur Verpackung von Substraten. Die Verpackungseinheit für Substrate umfasst ein erstes Substrat, einen Abstandshalter und ein zweites Substrat. Der Abstandshalterist auf das erste Substrat aufgelegt und das zweite Substrat ist auf den Abstandshalter aufgelegt. Ein Metalldepot ist jeweils auf eine Oberfläche des ersten Substrats und auf eine Oberfläche des zweiten Substrats aufgebracht und auf den beiden Metalldepots ist je ein Klebepunkt angeordnet. Der Abstandshalterist so auf das erste Substrat aufgelegt, dass der Abstandshalter das erste Substrat nur außerhalb des Klebepunkts berührt.Der Abstandshalter ist stegförmig. Zumindest das erste Substrat umfasst eine Vielzahl von nebeneinander angeordneten Einzelsubstraten und der Abstandshalter umrandet die Einzelsubstrate.
(EN)
The invention relates to a packaging unit for substrates, a packaging stack having packaging units of this type and a method for packaging substrates. The packaging unit for substrates comprises a first substrate, a spacer and a second substrate. The spacer is placed on the first substrate and the second substrate is placed on the spacer. A respective metal deposit is applied to a surface of the first substrate and to a surface of the second substrate and a respective adhesive point is arranged on the two metal deposits. The spacer is placed on the first substrate in such a way that the spacer is only in contact with the first substrate outside of the adhesive point. The spacer is bridge-shaped. At least the first substrate comprises a plurality of individual substrates arranged next to one another and the spacer borders the individual substrates.
(FR)
La présente invention concerne une unité d'emballage destinée à des substrats, une pile d'emballages comportant de telles unités d'emballage et un procédé pour emballer des substrats. L'unité d'emballage destinée à des substrats comprend un premier substrat, un élément d'écartement et un deuxième substrat. L'élément d'écartement est appliqué sur le premier substrat et le deuxième substrat est appliqué sur l'élément d'écartement. Un dépôt métallique est appliqué respectivement sur une surface du premier substrat et sur une surface du deuxième substrat, et un point de colle est placé respectivement sur chacun des deux dépôts métalliques. L'élément d'écartement est appliqué sur le premier substrat de façon à venir en contact avec le premier substrat uniquement à l'extérieur du point de colle. L'élément d'écartement se présente sous la forme d'une nervure. Au moins le premier substrat comprend une pluralité de substrats individuels juxtaposés et l'élément d'écartement encadre les substrats individuels.
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