Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020114684 - METHOD OF MANUFACTURING DEVICES

Publication Number WO/2020/114684
Publication Date 11.06.2020
International Application No. PCT/EP2019/079640
International Filing Date 30.10.2019
IPC
G03F 7/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
CPC
G03F 7/70525
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
70491Information management and control, including software
70525Controlling normal operating mode, e.g. matching different apparatus, remote control, prediction of failure
G03F 7/70616
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
G03F 7/70625
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
70625Pattern dimensions, e.g. line width, profile, sidewall angle, edge roughness
Applicants
  • ASML NETHERLANDS B.V. [NL]/[NL]
Inventors
  • SLACHTER, Abraham
  • TEL, Wim, Tjibbo
  • SLOTBOOM, Daan, Maurits
  • TIMOSHKOV, Vadim, Yourievich
  • VAN DER STRATEN, Koen, Wilhelmus, Cornelis, Adrianus
  • MENCHTCHIKOV, Boris
  • HASTINGS, Simon, Philip, Spencer
  • TABERY, Cyrus, Emil
  • GENIN, Maxime, Philippe, Frederic
  • ZHANG, Youping
  • ZOU, Yi
  • LIN, Chenxi
  • CHENG, Yana
Agents
  • PETERS, John Antoine
Priority Data
62/774,48003.12.2018US
62/814,54406.03.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD OF MANUFACTURING DEVICES
(FR) PROCÉDÉ DE PRODUCTION DE DISPOSITIFS
Abstract
(EN)
A method for analyzing a process, the method including: obtaining a multi-dimensional probability density function representing an expected distribution of values for a plurality of process parameters; obtaining a performance function relating values of the process parameters to a performance metric of the process; and using the performance function to map the probability density function to a performance probability function having the process parameters as arguments.
(FR)
L'invention concerne également un procédé d'analyse d'un processus, le procédé comprenant les étapes consistant à : obtenir une fonction de densité de probabilité multidimensionnelle représentant une distribution attendue de valeurs pour une pluralité de paramètres de traitement ; obtenir une fonction de performance mettant en relation des valeurs de paramètres de processus et une métrique de performance du processus ; et utiliser la fonction de performance pour mapper la fonction de densité de probabilité à une fonction de probabilité de performance ayant les paramètres de processus en tant qu'arguments.
Latest bibliographic data on file with the International Bureau