Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020114617 - HERMETIC PACKAGING OF ELECTRONIC COMPONENTS

Note: Text based on automatic Optical Character Recognition processes. Please use the PDF version for legal matters

[ EN ]

CLAIMS

1 . An implantable device comprising an electronic component (101 ) encapsulated by a hermetic packaging (10), said packaging comprising a top encapsulation layer (103) and a bottom encapsulation layer (104), wherein top and bottom encapsulation layer (103, 104) at least partially overlap so as to form a double layer (105, 105').

2. Implantable device according to claim 1 , wherein the double layer (105, 105') at least partially, more preferably fully covers the side walls (106, 106') of electronic component (101 ).

3. Implantable device according to claim 1 or 2, wherein top and/or the bottom encapsulation layer (103, 104) is/are biocompatible.

4. Implantable device according to any one of claims 1 to 3, wherein top and/or bottom encapsulation layer (103, 104) is/are corrosion-resistant.

5. Implantable device according to claim 3 or 4, wherein top and/or bottom encapsulation layer (103, 104) comprise or consist of metal; ceramic including oxides, nitrides, and carbides, preferably metal oxides, metal nitrides and metal carbides; diamond-like carbon; diamond; glass; polymers; combinations thereof, or combinations or multilayers thereof.

6. Implantable device according to claim 5, wherein said metal is selected from Ti, Pt, stainless steel, titanium-nickel, palladium, niobium, tantalum, combinations or alloys thereof, and multilayers thereof; wherein said ceramic is selected from the group consisting of silicon oxide, silicon nitride, silicon carbide, silicon oxicarbide, titanium carbide, titanium oxide, aluminum oxide, aluminum nitride, zirconium oxide, combinations thereof, and multilayers thereof; and/or said polymer is selected from the group consisting of fluorocarbons, polyurethane, polyether ether ketone (PEEK), silicone, PDMS, parylene, polyimide, polycarbonate, polycarbonate urethane, silicone, silicone- polyester-urethane, durimide (photo-definable polyimide), cyclic olefin polymer (COP), cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), polyphenylene, polysulfone, polyphenylsulfone, combinations thereof and multilayers thereof.

7. Implantable device according to any one of the preceding claims, wherein the packaging further comprises at least one top coating (107), preferably wherein top coating (107) and the top encapsulation layer (103) at least partially or fully overlap with each other.

8. Implantable device according to claim 7, wherein top coating (107) is biocompatible.

9. Implantable device according to claim 7 or 8, wherein top coating (107) is corrosion resistant.

10. Implantable device according to any one of claims 7 to 9, wherein top coating (107) is transparent.

1 1 . Implantable device according to any one of claims 7 to 10, wherein top coating (107) comprises or consists of a material selected from the group consisting of ceramic; glass including SiC, SiOC; SiCb; diamond or diamond like carbon; aluminum oxides; titanium oxides; combinations thereof; and multilayers thereof.

12. Implantable device according to any one of claims 7 to 1 1 , wherein said device, preferably said top coating (107) further comprises electronic traces (108) electronically connected to the electronic component (101 ), said electronic traces (108) preferably forming electrodes within or protruding from top coating (107).

13. Implantable device according to claim 12, wherein said electronic traces form electrodes, which are preferably bio-compatible and corrosion-resistant.

14. Implantable device according to claim 12 or 13, wherein said electronic traces comprise or consist of a material selected from the group consisting of platinum, black/porous platinum, iridium, iridium/platinum, iridium oxide, PEDOTrPSS, titanium nitride, doped diamond or doped diamond like carbon and graphene, and combinations thereof.

1 5. Implantable device according to any one of the preceding claims, wherein said electronic component (101 ) encapsulated by said hermetic packaging (10) comprises a layer (102).

16. Implantable device according to claim 1 5, wherein layer (102) comprises or consists of ceramics or glass, optionally selected from silicon oxide, optionally obtained by oxidation of a silicon substrate.

1 7. Implantable device according to any one of the preceding claims, further comprising at least one additional top encapsulation layer (103a) on top of top encapsulation layer (1 03) and/or at least one additional bottom encapsulation (104a) encapsulating bottom encapsulation layer (104).

1 8. Implantable device according to claim 1 7, wherein further encapsulation layers (103a, 104a) overlap so as to form at least one additional double layer (105a, 105b, 1 05c) optionally covering at least partially, more preferably fully, side walls (106, 106 of electronic component (101 ).

1 9. Implantable device according to claim 1 7 or 18, wherein top and/or bottom encapsulation layer (103, 103', 104, 104') is/are corrosion resistant and optionally bio compatible.

20. Implantable device according to any one of claims 1 7 to 19, wherein the at least one additional top and/or bottom encapsulation layer(s) (103a, 104a) is/are biocompatible and optionally corrosion-resistant.

21 . Implantable device according to any one of the preceding claims, wherein top and/or bottom encapsulation layers (103, 104) and/or optionally further top and/or bottom encapsulation layers (103a, 104a) comprise or consist of the same or a different material.

22. An implantable system comprising at least one packaged device according to any of claims 1 to 21 .

23. A method for packaging an implantable device, the method comprising

providing at least one electronic component (101 ) on a substrate (1 10);

applying at least one top encapsulation layer (103, 103') to electronic component (101 , 1 01 '); and

applying at least one bottom encapsulation layer (104, 104') to electronic component (101 , 101 ');

wherein the top and bottom encapsulation layer (103, 103', 104, 104') at least partially overlap so as to form a double layer (105, 105', 105a, 105b, 105c).

24. A method for packaging an implantable device, said method comprising the steps of:

providing an assembly (100) of at least one, preferably a plurality of electronic components (101 , 101 ') spaced apart from each other on a substrate (1 10), wherein adjacent electronic components (101 , 101 ') and substrate (1 10) define recess (1 1 1 ) in between electronic components (101 , 101 ');

applying at least one top encapsulation layer (103, 103') to assembly (100), thereby coating electronic components (101 , 10G) and lining recess (1 1 1 );

applying a removable layer (1 12) to assembly (100);

removing removable layer (1 12), thereby leaving a residual amount of removable layer (1 12) within lined recess (1 1 1 );

preferably upending assembly (100);

removing (i) substrate (1 10), (ii) top encapsulation layer (103) and (iii) residual amount of removable layer (1 12) from the assembly's bottom side; and

applying at least one bottom encapsulation layer (104, 104') to assembly (100), thereby preferably coating electronic components (101 , 101 ') and recess (1 1 1 ),

wherein the top and second bottom encapsulation layer (103, 103', 104, 104') are applied so as to at least partially overlap and forming a double layer (105, 105').

25. The method according to claim 23 or 24, wherein the double layer (105, 105') is provided so as to at least partially, more preferably fully cover the electronic component's side walls (106, 106').

26. The method according to any one of claims 23 to 25, further comprising a step of providing a top coating (107) by

(a) applying a top coating (107), preferably as defined in any one of the preceding claims, to the top side of electronic component (101 , 10G) (b) partially removing top coating (107) (c) applying at least one top encapsulation layer (103, 103'), preferably as defined in any one of the preceding claims, to the electronic component (101 , 101 '), such that top coating (107) and encapsulation layer(s) (103, 103') preferably at least partially overlap with each other;

or

(a') applying at least one top encapsulation layer(s) (103, 103'), preferably as defined in any one of the preceding claims, to electronic component (101 , 10G), (b') partially removing top encapsulation layer(s) (103, 103') from electronic component (101, 101 '), (c') applying a top coating (107), preferably as defined in any one of the preceding claims, to electronic component (101 , 101 '), such that top coating (107) and encapsulation layer(s) (103, 103') preferably at least partially overlap with each other.

27. The method according to claim 26, wherein step (2) includes partially removing top coating (107) or top encapsulation layer(s) (103, 103') by any chemical or physical process, preferably wet or dry etching and/or lift-off.

28. The method according to claim 26 or 27, wherein top coating (107) is applied by deposition, including chemical vapor deposition (CVD), including PECVD, or physical vapor deposition (PVD), or atomic layer deposition (ALD) or underlying layer oxidation.

29. The method according to any one of claims 23 to 28, further comprising a step of providing electronic traces (108) and/or electrodes (109), preferably within top coating (107), by deposition, including physical vapor deposition or electrodeposition, and/or patterning, including lift-off or etching.

30. The method according to any one of claims 24 to 29, further comprising prior to step (iv) a step of attaching the assembly's top side to a temporary carrier (1 13).

31 . The method according to any one of claims 24 to 30, wherein the substrate (1 10), top encapsulation layer (103) and/or removable layer (1 12) are removed by means each independently selected from physical and chemical means, including grinding, etching and/or stripping.

32. The method according to any one of claims 23 to 31 , wherein top and/or bottom encapsulation layer (103, 104) are biocompatible.

33. The method according to any one of claims 23 to 32, wherein top and/or bottom encapsulation layer (103, 103a, 104, 104a) are corrosion-resistant.

34. The method according to any one of claims 23 to 33, wherein top and/or the bottom encapsulation layer (103, 103a, 104, 104a) comprise or consist of a material optionally selected from a metal, including titanium, platinum, stainless steel, titanium-nickel, palladium, niobium, tantalum, alloys and multilayers thereof; a ceramic, including metal oxides, metal nitrides, and metal carbides such as silicon oxide, silicon nitride, silicon carbide, silicon oxicarbide, titanium carbide, aluminum oxide, aluminum nitride, zirconium oxide and multilayers thereof; diamond-like carbon; diamond; glass; low permeability and/or dense(specification!) polymers, including fluorocarbons, polyurethane, PEEK, silicone, PDMS, parylene, polyimide; or multilayers thereof.

35. The method according to any one of claims 25 to 34, wherein removable layer (1 12) comprises or consists of a material selected from a polymeric material, preferably a resin, more preferably a photosensitive resin, and a dissolvable polymeric material.

36. The method according to any one of claims 26 to 35, wherein top coating (107) is biocompatible.

37. The method according to any one of claims 26 to 36, wherein top coating (107) is corrosion-resistant.

38. The method according to any one of claims 26 to 37, wherein top coating (107) is transparent.

39. The method according to any one of claims 26 to 38, wherein top coating (107) comprises or consists of a material selected from ceramics; glass, including PECVD SiC, SiOC; SiCb; diamond or diamond like carbon; aluminum oxides; titanium oxides; or multilayers thereof.