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1. WO2020114423 - DISPLAY PANEL MANUFACTURING METHOD, DISPLAY PANEL, AND DISPLAY DEVICE

Publication Number WO/2020/114423
Publication Date 11.06.2020
International Application No. PCT/CN2019/122984
International Filing Date 04.12.2019
IPC
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 21/77 2017.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
CPC
H01L 21/77
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
Inventors
  • 李晓虎 LI, Xiaohu
  • 焦志强 JIAO, Zhiqiang
  • 刘暾 LIU, Tun
  • 闫华杰 YAN, Huajie
Agents
  • 北京三高永信知识产权代理有限责任公司 BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY AGENCY CO., LTD.
Priority Data
201811489984.906.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) DISPLAY PANEL MANUFACTURING METHOD, DISPLAY PANEL, AND DISPLAY DEVICE
(FR) PROCÉDÉ DE FABRICATION DE PANNEAU D'AFFICHAGE, PANNEAU D'AFFICHAGE ET DISPOSITIF D'AFFICHAGE
(ZH) 显示面板的制造方法、显示面板和显示装置
Abstract
(EN)
A display panel manufacturing method, a display panel (20), and a display device, belonging to the technical field of display. The method comprises: forming a substrate structure (24) on a target area (K) of a base substrate (21); forming a display structure layer (27) on the base substrate (21) formed with the substrate structure (24); in an area where an orthographic projection of the substrate structure (24) on the display structure layer (27) is located, forming a circular trench (C) in the display structure layer (27) in which the substrate structure (24) is exposed; and removing the substrate structure (24) surrounded by the circular trench (C), so that the display structure layer (27) surrounded by the circular trench (C) is separated from the base substrate (21). A part of the display structure layer (27) on the substrate structure (24) is separated from the base substrate (21) by removing the substrate structure (24) located in the target area (K). In this way, the target area (K) is a transparent area, and an image acquisition assembly or other assemblies can be provided on a position corresponding to the transparent area. Therefore, a problem of low yield of the display panel in related technology is solved, and an effect of improving the yield of the display panel is implemented.
(FR)
Procédé de fabrication de panneau d'affichage, panneau d'affichage (20) et dispositif d'affichage, se rapportant au domaine technique de l'affichage. Le procédé consiste à : former une structure de substrat (24) sur une zone cible (K) d'un substrat (21) de base ; former une couche de structure d'affichage (27) sur le substrat (21) de base formé avec la structure (24) de substrat ; dans une zone où une projection orthographique de la structure (24) de substrat sur la couche de structure d'affichage (27) est située, former une tranchée circulaire (C) dans la couche de structure d'affichage (27) dans laquelle la structure (24) de substrat est exposée ; et éliminer la structure (24) de substrat entourée par la tranchée circulaire (C), de telle sorte que la couche de structure d'affichage (27) entourée par la tranchée circulaire (C) est séparée du substrat (21) de base. Une partie de la couche de structure d'affichage (27) sur la structure (24) de substrat est séparée du substrat (21) de base par élimination de la structure (24) de substrat située dans la zone cible (K). De cette manière, la zone cible (K) est une zone transparente, et un ensemble d'acquisition d'image ou d'autres ensembles peuvent être disposés sur une position correspondant à la zone transparente. Par conséquent, un problème de faible rendement du panneau d'affichage dans la technologie associée est résolu, et un effet d'amélioration du rendement du panneau d'affichage est mis en oeuvre.
(ZH)
一种显示面板的制造方法、显示面板(20)和显示装置,属于显示技术领域。所述方法包括:在衬底基板(21)上的目标区域(K)形成衬底结构(24);在形成有衬底结构(24)的衬底基板(21)上形成显示结构层(27);衬底结构(24)在显示结构层(27)上的正投影所在区域中,在显示结构层(27)中形成环状沟槽(C),衬底结构(24)在环状沟槽(C)中露出;去除环状沟槽(C)围绕的衬底结构(24),以使环状沟槽(C)所围绕的显示结构层(27)与衬底基板(21)分离。通过去除位于目标区域(K)的衬底结构(24)使该衬底结构(24)上的部分显示结构层(27)与衬底基板(21)分离。如此该目标区域(K)即为透明区域,可以在与该透明区域对应的位置设置图像获取组件或其它组件。解决了相关技术中显示面板的良率较低的问题。达到了提高显示面板的良率的效果。
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