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1. WO2020114193 - LINE STRUCTURE OF CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

Publication Number WO/2020/114193
Publication Date 11.06.2020
International Application No. PCT/CN2019/116594
International Filing Date 08.11.2019
IPC
H05K 1/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
CPC
H05K 1/0228
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
0216Reduction of cross-talk, noise or electromagnetic interference
0228Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
H05K 1/18
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 2201/09327
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
0929Conductive planes
09327Special sequence of power, ground and signal layers in multilayer PCB
Applicants
  • 维沃移动通信有限公司 VIVO MOBILE COMMUNICATION CO., LTD. [CN]/[CN]
Inventors
  • 张卫鹏 ZHANG, Weipeng
Agents
  • 北京银龙知识产权代理有限公司 DRAGON INTELLECTUAL PROPERTY LAW FIRM
Priority Data
201811466251.303.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) LINE STRUCTURE OF CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
(FR) STRUCTURE DE LIGNE DE CARTE DE CIRCUIT IMPRIMÉ, ENSEMBLE CARTE DE CIRCUIT IMPRIMÉ ET DISPOSITIF ÉLECTRONIQUE
(ZH) 电路板线路结构、电路板组件和电子设备
Abstract
(EN)
A line structure of a circuit board, a circuit board assembly and an electronic device, wherein the line structure of a circuit board is applied to a circuit board (2) configured with a component (1), and the circuit board (2) is a multi-layered circuit board the number of layers of which is equal to or greater than two; a line of the circuit board (2) comprises a line section (31) that passes through an orthographic projection area of the component (1); the line section (31) comprises an even number of layers of wiring, each layer of wiring of the line section (31) is respectively provided on a different layer of the circuit board (2), each layer of wiring of the line section (31) is connected in sequence by means of a connection section (313), and the directions of the currents of two adjacent layers of wiring of the line section (31) are opposite.
(FR)
L'invention concerne une structure de ligne d'une carte de circuit imprimé, un ensemble carte de circuit imprimé et un dispositif électronique, la structure de ligne d'une carte de circuit imprimé étant appliquée à une carte de circuit imprimé (2) configurée avec un composant (1), et la carte de circuit imprimé (2) étant une carte de circuit imprimé multicouche dont le nombre de couches est égal ou supérieur à deux ; une ligne de la carte de circuit imprimé (2) comprend une section de ligne (31) qui passe à travers une zone de projection orthographique du composant (1) ; la section de ligne (31) comprend un nombre pair de couches de câblage, chaque couche de câblage de la section de ligne (31) est respectivement disposée sur une couche différente de la carte de circuit imprimé (2), chaque couche de câblage de la section de ligne (31) est connectée en séquence au moyen d'une section de connexion (313), et les directions des courants de deux couches adjacentes de câblage de la section de ligne (31) sont opposées.
(ZH)
一种电路板线路结构、电路板组件和电子设备,其中,电路板线路结构应用于设置有器件(1)的电路板(2),所述电路板(2)为层数大于或等于2的多层电路板;所述电路板(2)线路具有经过所述器件(1)正投影区域的线路段(31);所述线路段(31)包括偶数层走线,所述线路段(31)的各层走线分别设置于所述电路板(2)的不同层,所述线路段(31)的各层走线通过连接段(313)顺次连接,所述线路段(31)的相邻两层走线的电流方向相反。
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Latest bibliographic data on file with the International Bureau