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1. WO2020113846 - THIN FILM PACKAGING STRUCTURE AND THIN FILM PACKAGING METHOD

Publication Number WO/2020/113846
Publication Date 11.06.2020
International Application No. PCT/CN2019/078456
International Filing Date 18.03.2019
IPC
H01L 51/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52Details of devices
H01L 51/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
CPC
H01L 51/5237
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5237Passivation; Containers; Encapsulation, e.g. against humidity
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 王蕊 WANG, Rui
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT & TRADEMARK AGENCY
Priority Data
201811472511.804.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) THIN FILM PACKAGING STRUCTURE AND THIN FILM PACKAGING METHOD
(FR) STRUCTURE D'ENCAPSULATION DE FILM MINCE ET PROCÉDÉ D'ENCAPSULATION DE FILM MINCE
(ZH) 一种薄膜封装结构及薄膜封装方法
Abstract
(EN)
Provided by the present invention is a thin film packaging structure, comprising an OLED device, a first inorganic layer, a grid barrier, an organic layer, and a second inorganic layer; the first inorganic layer covers an upper surface of the OLED device, the grid barrier is formed on an upper surface of the first inorganic layer, and the grid barrier comprises a plurality of grids; the organic layer is filled within the grids and is deposited on the upper surface of the first inorganic layer; and the second inorganic layer wraps the grid barrier, an upper surface of the organic layer, and side surfaces of the OLED device, grid barrier, and first inorganic layer. Further provided by the present invention is a thin film packaging method, comprising the following steps: a preparation step, a grid barrier preparation step, an organic layer preparation step, and a second inorganic layer preparation step. By means of adding a grid barrier in a thin film packaging structure, the present invention may effectively prevent stationary points of ink from overflowing and overlapping, thereby improving manufacturing efficiency, causing an organic film layer to be uniform, and improving the light-emitting performance of a device.
(FR)
La présente invention concerne une structure d'encapsulation de film mince, comprenant un dispositif à OLED, une première couche inorganique, une barrière à grille, une couche organique, et une seconde couche inorganique ; la première couche inorganique recouvre une surface supérieure du dispositif à OLED, la barrière à grille est formée sur une surface supérieure de la première couche inorganique, et la barrière à grille comprend une pluralité de grilles ; la couche organique est remplie à l'intérieur des grilles et est déposée sur la surface supérieure de la première couche inorganique ; et la seconde couche inorganique enveloppe la barrière à grille, une surface supérieure de la couche organique, et des surfaces latérales du dispositif à OLED, de la barrière à grille et de la première couche inorganique. La présente invention concerne en outre un procédé d'encapsulation de film mince, comprenant les étapes suivantes : une étape de préparation, une étape de préparation de barrière à grille, une étape de préparation de couche organique, et une seconde étape de préparation de couche inorganique. Au moyen de l'ajout d'une barrière à grille dans une structure d'encapsulation de film mince, la présente invention peut empêcher efficacement des points fixes d'encre de déborder et de se chevaucher, ce qui permet d'améliorer l'efficacité de fabrication, d'amener une couche de film organique à être uniforme, et d'améliorer les performances d'électroluminescence d'un dispositif.
(ZH)
本发明提供一种薄膜封装结构,包括OLED器件、第一无机层、栅格挡墙、有机层和第二无机层;所述第一无机层覆盖至所述OLED器件上表面;所述栅格挡墙形成于所述第一无机层上表面,所述栅格挡墙包括多个栅格;以及所述有机层被填充至所述栅格内,且沉积在所述第一无机层上表面;所述第二无机层包覆所述栅格挡墙、所述有机层上表面及所述OLED器件、所述栅格挡墙、所述第一无机层的侧面。本发明还提供一种薄膜封装方法,包括以下步骤:准备步骤、栅格挡墙制备步骤、有机层制备步骤和第二无机层制备步骤。本发明通过在薄膜封装结构中增加了栅格挡墙,可以有效地防止墨水驻点的溢出和重叠,从而提高制作效率,并且使有机膜层均匀,提高器件发光的性能。
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