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1. WO2020113829 - DISPLAY DEVICE AND PACKAGING METHOD THEREFOR

Publication Number WO/2020/113829
Publication Date 11.06.2020
International Application No. PCT/CN2019/076138
International Filing Date 26.02.2019
IPC
H01L 51/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52Details of devices
H01L 51/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
CPC
H01L 51/5253
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5237Passivation; Containers; Encapsulation, e.g. against humidity
5253Protective coatings
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • 深圳市华星光电半导体显示技术有限公司 SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 杨中国 YANG, Zhongguo
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT&TRADEMARK AGENCY
Priority Data
201811495429.707.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) DISPLAY DEVICE AND PACKAGING METHOD THEREFOR
(FR) DISPOSITIF D’AFFICHAGE ET SON PROCÉDÉ D’ENCAPSULATION
(ZH) 一种显示装置及其封装方法
Abstract
(EN)
Disclosed are a display device and a packaging method therefor. The display device has a light-emitting area defined therein, the light-emitting area comprising a substrate, a unit function layer and a packaging layer, wherein a bending area is provided in the light-emitting area; and the packaging layer located in the bending area comprises a first graphene layer, a buffer layer and a second graphene layer, wherein same are stacked in sequence. The packaging method comprises the steps of providing a glass substrate; fabricating a polyimide layer on the glass substrate; fabricating a thin film transistor layer on the polyimide layer to form a substrate; fabricating an organic light-emitting diode display layer on the substrate; fabricating an insulating layer on the organic light-emitting diode display layer; fabricating a packaging layer on the insulating layer; and providing a first flexible barrier membrane, and attaching the first flexible barrier membrane to the substrate. According to the present invention, graphene is used in the packaging of a foldable OLED device where a folding area is located in a light-emitting area, so as to prevent the barrier membrane from generating cracks at folding positions in order to achieve folding with the radius of curvature being less than 1 mm, thereby improving the packaging effect.
(FR)
L’invention concerne un dispositif d’affichage et son procédé d’encapsulation. Une zone électroluminescente est définie dans le dispositif d’affichage, la zone électroluminescente comprenant un substrat, une couche de fonction d’unité, et une couche d’encapsulation, une zone de courbure étant réalisée dans la zone électroluminescente ; et la couche d’encapsulation située dans la zone de courbure comprend une première couche de graphène, une couche tampon et une deuxième couche de graphène ; ces dernières étant empilées dans cet ordre. Les étapes du procédé d’encapsulation consistent à produire un substrat de verre ; à fabriquer une couche de polyimide sur le substrat de verre ; à fabriquer une couche de transistor à couche mince sur la couche de polyimide pour former un substrat ; à fabriquer une couche d’affichage à diodes électroluminescentes organiques sur le substrat ; à fabriquer une couche isolante sur la couche d’affichage à diodes électroluminescentes organiques ; à fabriquer une couche d’encapsulation sur la couche isolante ; et à produire une première membrane de barrière flexible, et à fixer la première membrane de barrière flexible au substrat. Selon la présente invention, du graphène est utilisé dans le conditionnement d’un dispositif à DELO pliable où une zone pliable est située dans une zone électroluminescente, afin d’empêcher que la membrane de barrière génère des fissures à des positions de pliage afin d’obtenir un pliage dont le rayon de courbure est inférieur à 1 mm, améliorant ainsi l’effet d’encapsulation.
(ZH)
本发明公开了一种显示装置及其封装方法。显示装置定义有发光区,发光区包括基板、单元功能层和封装层;其中发光区内设有弯折区,位于所述弯折区的封装层包括依次层叠设置的第一石墨烯层、缓冲层和第二石墨烯层。封装方法包括步骤:提供一玻璃基板;在玻璃基板上制作聚酰亚胺层;在聚酰亚胺层上制作薄膜晶体管层,构成基板;在基板上制作有机发光二极管显示器件层;在有机发光二极管显示器件层上制作绝缘层;在绝缘层上制作封装层;提供第一柔性阻隔膜,并将第一柔性阻隔膜与所述基板贴合。本发明将石墨烯用于折叠区在发光区内的折叠式OLED器件的封装中,避免阻隔膜在折叠处产生裂纹,实现曲率半径小于1mm的折叠,从而提高封装效果。
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