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1. WO2020113797 - FLEXIBLE ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL

Publication Number WO/2020/113797
Publication Date 11.06.2020
International Application No. PCT/CN2019/072492
International Filing Date 21.01.2019
IPC
H01L 27/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
G09F 9/30 2006.01
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
CPC
G09F 9/301
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
301flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
H01L 27/1218
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1214comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
1218with a particular composition or structure of the substrate
H01L 27/124
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1214comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
124with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
H01L 27/1259
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1214comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
1259Multistep manufacturing methods
H01L 51/003
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
003using a temporary substrate
H01L 51/0097
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0096Substrates
0097flexible substrates
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 柯霖波 KE, Linbo
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT & TRADEMARK AGENCY
Priority Data
201811486659.706.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) FLEXIBLE ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL
(FR) SUBSTRAT DE RÉSEAU FLEXIBLE ET SON PROCÉDÉ DE FABRICATION, ET PANNEAU D'AFFICHAGE
(ZH) 柔性阵列基板及其制作方法、显示面板
Abstract
(EN)
Disclosed are a flexible array substrate and a manufacturing method therefor, and a display panel. In the flexible array substrate, the thickness of a flexible substrate (200) in a bending region (B) is reduced by means of a patterned filling layer (111), and the flexible substrate (200) and the filling layer (111) are separated from each other by using a stripping layer (112), such that a metal wiring layer in the bending region (B) tends to a stress neutral surface, and thus, a flexible array substrate with an excellent bending performance is realized. The bending performance of the flexible array substrate in the bending region (B) is improved by means of thinning the flexible substrate (200) in the bending region (B) while the excellent performance of a polyimide material is maintained, such that the problems of internal stress increase, bending and breakage of metal wiring and the like, which may occur in the bending region (B), are avoided.
(FR)
La présente invention concerne un substrat de réseau flexible et son procédé de fabrication, ainsi qu'un panneau d'affichage. Dans le substrat de réseau flexible, l'épaisseur d'un substrat flexible (200) dans une région de flexion (B) est réduite au moyen d'une couche de remplissage à motifs (111), et le substrat flexible (200) et la couche de remplissage (111) sont séparés l'un de l'autre au moyen d'une couche de pelage (112), de telle sorte qu'une couche de câblage métallique dans la région de flexion (B) tende vers une surface neutre de contrainte, et ainsi, un substrat de réseau flexible doué d'une excellente performance de flexion est obtenu. La performance de flexion du substrat de réseau flexible dans la région de flexion (B) est améliorée au moyen de l'amincissement du substrat flexible (200) dans la région de flexion (B) tout en maintenant les performances excellentes d'un matériau de polyimide, de telle sorte que les problèmes d'augmentation de contrainte interne, de flexion et de rupture de câblage métallique et similaires, qui peuvent se produire dans la région de flexion (B), soient évités.
(ZH)
一种柔性阵列基板及其制作方法、显示面板。所述柔性阵列基板通过图案化的填充层(111)减薄弯折区(B)的柔性衬底(200)的厚度,并且使用剥离层(112)分离柔性衬底(200)和填充层(111),使得弯折区(B)的金属走线层趋向应力中性面,从而实现弯折性能优异的柔性阵列基板。在保持聚酰亚胺材料优异性能的同时,利用弯折区(B)的柔性衬底(200)减薄来改善柔性阵列基板在弯折区(B)的弯折性能,从而避免弯折区(B)可能出现的内应力增加、金属走线弯折断裂等问题。
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Latest bibliographic data on file with the International Bureau