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1. WO2020113794 - DISPLAY PANEL AND FABRICATING METHOD THEREFOR

Publication Number WO/2020/113794
Publication Date 11.06.2020
International Application No. PCT/CN2019/072316
International Filing Date 18.01.2019
IPC
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
CPC
H01L 2227/323
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2227Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
32Devices including an organic light emitting device [OLED], e.g. OLED display
323Multistep processes for AMOLED
H01L 27/3258
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3258Insulating layers formed between TFT elements and OLED elements
H01L 27/3276
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3276Wiring lines
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 杨薇薇 YANG, Weiwei
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT & TRADEMARK AGENCY
Priority Data
201811465807.703.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) DISPLAY PANEL AND FABRICATING METHOD THEREFOR
(FR) PANNEAU D’AFFICHAGE ET SON PROCÉDÉ DE FABRICATION
(ZH) 显示面板及其制造方法
Abstract
(EN)
A display panel and a fabricating method therefor. The display panel (10) comprises a substrate (11), an active layer (12), an insulating layer (13), a first metal layer (14), an organic insulating layer (15), and a second metal layer (16). In the present method, an organic material is used as a dielectric insulating layer to avoid cracking of the display panel due to a large stress accumulated during bending. The organic materials has a minimum aperture of perforations greater than that of inorganic materials and is not conducive to fabricate a high-pixel-density display panel; therefore, by electrically connecting a first contact portion (142) and a second contact portion (143) of the first metal layer (14) to the active layer, and electrically connecting a source (162) and a drain (163) of the second metal layer (16) to the first contact portion (142) and the second contact portion (143), respectively, the method can be applied to high-pixel-density display panels.
(FR)
L'invention concerne un panneau d'affichage et son procédé de fabrication. Le panneau d'affichage (10) comprend un substrat (11), une couche active (12), une couche d'isolation (13), une première couche métallique (14), une couche d'isolation organique (15) et une seconde couche métallique (16). Dans le présent procédé, un matériau organique est utilisé en tant que couche d'isolation diélectrique pour éviter la fissuration du panneau d'affichage due à une contrainte importante accumulée pendant la courbure. Les matériaux organiques ont une ouverture minimale de perforations supérieure à celle de matériaux inorganiques et n'est pas propice à la fabrication d'un panneau d'affichage à haute densité de pixels ; par conséquent, en connectant électriquement une première partie de contact (142) et une seconde partie de contact (143) de la première couche métallique (14) à la couche active, et connecter électriquement une source (162) et un drain (163) de la seconde couche métallique (16) à la première partie de contact (142) et à la seconde partie de contact (143), respectivement, le procédé peut être appliqué à des panneaux d'affichage à haute densité de pixels.
(ZH)
一种显示面板及其制造方法,显示面板(10)包含基板(11)、有源层(12)、绝缘层(13)、第一金属层(14)、有机绝缘层(15)及第二金属层(16)。该方法通过以有机材料作为介电绝缘层,以减少显示面板在弯折时积累较大应力,而容易发生破裂的问题。由于有机材料的穿孔的最小孔径大于无机材料的穿孔的最小孔径而不利于高像素密度的显示面板,因此通过第一金属层(14)的第一接触部(142)和第二接触部(143)电连接有源层,以及第二金属层(16)的源极(162)和漏极(163)分别电连接第一接触部(142)和第二接触部(143),可应用于高像素密度的显示面板。
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