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1. WO2020113783 - FABRICATION METHOD FOR DISPLAY SCREEN

Publication Number WO/2020/113783
Publication Date 11.06.2020
International Application No. PCT/CN2019/071946
International Filing Date 16.01.2019
IPC
H01L 51/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52Details of devices
H01L 51/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
CPC
H01L 27/3244
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
H01L 51/5237
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5237Passivation; Containers; Encapsulation, e.g. against humidity
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 叶剑 YE, Jian
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT&TRADEMARK AGENCY
Priority Data
201811486645.506.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) FABRICATION METHOD FOR DISPLAY SCREEN
(FR) PROCÉDÉ DE FABRICATION D'ÉCRAN D'AFFICHAGE
(ZH) 一种显示屏的制作方法
Abstract
(EN)
A fabrication method for a display screen (10), the fabrication method comprising: successively fabricating a switch array layer, organic light-emitting display layer and first packaging layer (25) on a flexible substrate (11); fabricating a first portion (31) of a via on the first packaging layer (25); fabricating a second packaging layer (26) within the first portion (31) of the via and on the first packaging layer (25); removing the second packaging layer (26) corresponding to the location of a preset camera hole; and fabricating a second portion (32) of the via on the flexible substrate (11).
(FR)
L'invention concerne un procédé de fabrication d'un écran d'affichage (10), le procédé de fabrication consistant à : fabriquer successivement une couche de réseau de commutateurs, une couche d'affichage électroluminescent organique et une première couche d'encapsulation (25) sur un substrat souple (11) ; fabriquer une première partie (31) d'un trou d'interconnexion sur la première couche d'encapsulation (25) ; fabriquer une seconde couche d'encapsulation (26) à l'intérieur de la première partie (31) du trou d'interconnexion et sur la première couche d'encapsulation (25) ; retirer la seconde couche d'encapsulation (26) correspondant à l'emplacement d'un trou de caméra prédéfini ; et fabriquer une seconde partie (32) du trou d'interconnexion sur le substrat souple (11).
(ZH)
一种显示屏(10)的制作方法,该制作方法包括:在柔性衬底(11)上依次制作开关阵列层、有机发光显示层以及第一封装层(25);在第一封装层(25)上制作过孔的第一部分(31);在过孔的第一部分(31)内以及第一封装层(25)上制作第二封装层(26);将与预设摄像头孔的位置对应的第二封装层(26)去除;在柔性衬底(11)上制作过孔的第二部分(32)。
Also published as
Latest bibliographic data on file with the International Bureau