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1. WO2020113760 - DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY MODULE

Publication Number WO/2020/113760
Publication Date 11.06.2020
International Application No. PCT/CN2019/070678
International Filing Date 07.01.2019
IPC
H01L 27/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
CPC
H01L 2227/323
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2227Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
32Devices including an organic light emitting device [OLED], e.g. OLED display
323Multistep processes for AMOLED
H01L 27/1218
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1214comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
1218with a particular composition or structure of the substrate
H01L 27/3223
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3223combined with dummy elements, i.e. non-functional features
H01L 27/3244
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 夏冲冲 XIA, Chongchong
  • 余威 YU, Wei
  • 杨杰 YANG, Jie
  • 王义 WANG, Yi
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT & TRADEMARK AGENCY
Priority Data
201811485629.406.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY MODULE
(FR) PANNEAU D'AFFICHAGE ET SON PROCÉDÉ DE FABRICATION, ET MODULE D'AFFICHAGE
(ZH) 显示面板及其制作方法、显示模组
Abstract
(EN)
A display panel (100) and a manufacturing method thereof, and a display module. The display panel (100) comprises: a substrate (101); a thin film transistor layer (200) positioned at the substrate (101); a planarization layer (111) positioned at the thin film transistor layer (200); a light-emitting device layer (400) positioned at the planarization layer (111); and an encapsulation layer (500) positioned at the light-emitting device layer (400), wherein the planarization layer (111) comprises a first protrusion (112), and an orthographic projection of the light-emitting device layer (400) on the first protrusion (112) is within the first protrusion (112).
(FR)
L’invention concerne un panneau d’affichage (100) et son procédé de fabrication, et un module d’affichage. Le panneau d'affichage (100) comprend : un substrat (101) ; une couche de transistor à couches minces (200) positionnée au niveau du substrat (101) ; une couche de planarisation (111) positionnée au niveau de la couche de transistor à couches minces (200) ; une couche de dispositif électroluminescent (400) positionnée au niveau de la couche de planarisation (111) ; et une couche d'encapsulation (500) positionnée au niveau de la couche de dispositif électroluminescent (400), la couche de planarisation (111) comprenant une première saillie (112), et une projection orthographique de la couche de dispositif électroluminescent (400) sur la première saillie (112) se trouve à l'intérieur de la première saillie (112).
(ZH)
一种显示面板(100)及其制作方法、显示模组,包括:基板(101);位于基板(101)上的薄膜晶体管层(200);位于薄膜晶体管层(200)上的平坦层(111);位于平坦层(111)上的发光器件层(400);位于发光器件层(400)上的封装层(500);其中,平坦层(111)包括第一凸起(112),发光器件层(400)在第一凸起(112)的正投影位于第一凸起(112)内。
Also published as
Latest bibliographic data on file with the International Bureau