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1. WO2020113754 - DISPLAY MODULE, FABRICATION METHOD THEREFOR, AND ELECTRONIC APPARATUS

Publication Number WO/2020/113754
Publication Date 11.06.2020
International Application No. PCT/CN2019/070290
International Filing Date 03.01.2019
IPC
H01L 51/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52Details of devices
H01L 51/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
CPC
H01L 27/3244
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
H01L 51/5246
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5237Passivation; Containers; Encapsulation, e.g. against humidity
524Sealing arrangements having a self-supporting structure, e.g. containers
5246characterised by the peripheral sealing arrangements, e.g. adhesives, sealants
H01L 51/5293
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5293Arrangements for polarized light emission
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 汤威 TANG, Wei
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT & TRADEMARK AGENCY
Priority Data
201811464859.203.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) DISPLAY MODULE, FABRICATION METHOD THEREFOR, AND ELECTRONIC APPARATUS
(FR) MODULE D'AFFICHAGE, SON PROCÉDÉ DE FABRICATION ET APPAREIL ÉLECTRONIQUE
(ZH) 显示模组及其制作方法、电子装置
Abstract
(EN)
A display module, a fabrication method therefor, and an electronic apparatus, the display module comprising: a display panel (200), a polarizer layer (60) located on the display panel (200), a cover layer (70) located on the polarizer layer (60), and an adhesive layer (80) located between the polarizer layer (60) and the cover layer (70), wherein the adhesive layer (80) is an ultraviolet light-reducing sticky adhesive layer.
(FR)
L'invention concerne un module d'affichage, son procédé de fabrication et un appareil électronique, le module d'affichage comprenant : un panneau d'affichage (200), une couche de polariseur (60) située sur le panneau d'affichage (200), une couche de couvercle (70) située sur la couche de polariseur (60), et une couche adhésive (80) située entre la couche de polariseur (60) et la couche de couvercle (70), la couche adhésive (80) étant une couche adhésive collante réduisant la lumière ultraviolette.
(ZH)
一种显示模组及其制作方法、电子装置,显示模组包括:显示面板(200);位于显示面板(200)上的偏光片层(60);位于偏光片层(60)上的盖板层(70);以及位于偏光片层(60)与盖板层(70)之间的粘结层(80);其中,粘结层(80)为紫外光减粘型粘结层。
Also published as
Latest bibliographic data on file with the International Bureau