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1. WO2020113385 - DISPLAY PANEL AND DISPLAY MODULE

Publication Number WO/2020/113385
Publication Date 11.06.2020
International Application No. PCT/CN2018/118986
International Filing Date 03.12.2018
IPC
H01L 23/488 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
H01L 23/538 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
G02F 1/13 2006.01
GPHYSICS
02OPTICS
FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
1Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
01for the control of the intensity, phase, polarisation or colour
13based on liquid crystals, e.g. single liquid crystal display cells
CPC
G02F 1/13
GPHYSICS
02OPTICS
FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
1Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
01for the control of the intensity, phase, polarisation or colour 
13based on liquid crystals, e.g. single liquid crystal display cells
H01L 23/488
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
H01L 23/538
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
Applicants
  • 深圳市柔宇科技有限公司 SHENZHEN ROYOLE TECHNOLOGIES CO., LTD. [CN]/[CN]
Inventors
  • 张祖强 CHANG, Tsuchiang
  • 吴焕达 WU, Huanda
  • 谭桂财 TAN, Guicai
  • 邱昌明 QIU, Changming
Agents
  • 深圳市瑞方达知识产权事务所(普通合伙) SHENZHEN REFINED INTELLECTUAL PROPERTY OFFICE (GENERAL PARTNERSHIP)
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) DISPLAY PANEL AND DISPLAY MODULE
(FR) PANNEAU D'AFFICHAGE ET MODULE D'AFFICHAGE
(ZH) 显示面板以及显示模组
Abstract
(EN)
A display panel and a display module. The display panel is provided with a bonding area for bonding to a bonding object; the bonding area is provided with multiple first bond pads and a wire, wherein the height of the first bond pad is greater than that of the wire. By means of the structures of the first bond pad of the display panel and a second bond pad of the bonding object, conductive particles in a conductive medium can be prevented from directly pressing on the wire, and short circuit or electricity leakage of the display panel can be avoided.
(FR)
La présente invention concerne un panneau d'affichage et un module d'affichage. Le panneau d'affichage comporte une zone de soudure pour une soudure à un objet de soudure; la zone de soudure comporte de multiples premiers plots de soudure et un fil, la hauteur du premier plot de soudure étant supérieure à celle du fil. Au moyen des structures du premier plot de soudure du panneau d'affichage et d'un second plot de soudure de l'objet de soudure, des particules conductrices dans un milieu conducteur peuvent être empêchées de presser directement sur le fil, et un court-circuit ou une fuite d'électricité du panneau d'affichage peut être évité(e).
(ZH)
一种显示面板和显示模组,显示面板上设有用于与绑定对象绑定的绑定区,绑定区上设有多个第一接合垫,绑定区上设有导线,第一接合垫的高度大于导线的高度。通过显示面板的第一接合垫以及绑定对象的第二接合垫的结构,能够有效地避免导电介质中的导电粒子直接压在导线上,避免造成显示面板线路短路或漏电。
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