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1. WO2020112784 - APPARATUS AND METHOD FOR RECIRCULATING FLUIDS

Publication Number WO/2020/112784
Publication Date 04.06.2020
International Application No. PCT/US2019/063266
International Filing Date 26.11.2019
IPC
B08B 3/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3Cleaning by methods involving the use or presence of liquid or steam
02Cleaning by the force of jets or sprays
H01L 21/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
CPC
B08B 3/02
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3Cleaning by methods involving the use or presence of liquid or steam
02Cleaning by the force of jets or sprays
H01L 21/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Applicants
  • MEGA FLUID SYSTEMS, INC. [US]/[US]
Inventors
  • EISELER, Robert
  • MURAI, Koh
  • PERKINS, II, Michael
Agents
  • GRAFF, ESQ., Jacquelyn A.
Priority Data
62/774,15630.11.2018US
62/892,84728.08.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) APPARATUS AND METHOD FOR RECIRCULATING FLUIDS
(FR) APPAREIL ET PROCÉDÉ DE RECIRCULATION DE FLUIDES
Abstract
(EN)
An apparatus for recirculating fluids in semiconductor systems. The apparatus including a base portion, an inlet portion coupled to a first end of the base portion, and a nozzle coupled to a second end of the base portion. The nozzle including a helical groove extending from a position near a nozzle base portion to a position near a tip of the nozzle portion. The helical groove extending from an exterior surface through the nozzle portion to an interior surface of the nozzle portion. Methods of using the apparatus in a semiconductor recirculation system are also disclosed.
(FR)
L'invention concerne un appareil de recirculation de fluides dans des systèmes semi-conducteurs. L'appareil comprend une partie base, une partie introduction accouplée à une première extrémité de la partie base, et une buse accouplée à une seconde extrémité de la partie base. La buse comprend une rainure hélicoïdale s'étendant depuis une position proche d'une partie base de buse jusqu'à une position proche d'une pointe de la partie buse. La rainure hélicoïdale s'étend depuis une surface extérieure à travers la partie buse jusqu'à une surface intérieure de la partie buse. L'invention concerne également des procédés d'utilisation de l'appareil dans un système de recirculation à semi-conducteurs.
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